MIL-PRF-38535K
TABLE II. Group B tests (Mechanical and environmental test) . – Continued.
Group B tests for QML microcircuits
Group B tests for class level B and S microcircuits
(TM 5005 of MIL-STD-883)
Subgroups
1/
(MIL-PRF-38535)
Class Q
Class V
Class Y
Class level B
Class level S
Subgroup 5
a. Bond strength TM 2011 15(0) 11/
(1) Thermo compression -
sample size 45(0)
Test condition C or D
(2) Ultrasonic - condition C or D
(4) Beam lead - condition H
a. End-point electrical parameters 12/
- As specified in the applicable device
specification
b. Die shear test or substrate attach strength or stud
pull test including passive elements
TM 2019 or TM 2027 3(0)
b. Steady state life test 13/
TM 1005 Test condition C, D or E
c. Flip chip pull off test
TM 2031 or TM 2011 2(0)
c. End-point electrical parameters 12/
- As specified in the applicable device
specification
d. Flip chip die shear strength test or substrate attach
strength test (test perform post underfill cure)
TM 2019 or TM 2027
3(0)
Subgroup 6
Sample size 15(0)
14/
a. Temperature cycling TM 1010,
condition C, 100 cycles minimum
b. Constant acceleration TM 2001, condition E,
Y1 orientation only
c. Seal test TM 1014
(1) Fine leak
(2) Gross leak
d. End-point electrical parameters - As specified
in the applicable device specification
Note: The screening and QCI/TCI tables from MIL-PRF-38535 and MIL-STD-883 Test Methods 5004 and 5005 have been combined for consistency. A future revision of
MIL-STD-883 will reflect this change as well. Manufacturers shall document in their QM plan the screening and QCI/TCI requirements to either MIL-PRF-38535 or MIL-STD-883.
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ACTEL [ Actel Corporation ]
