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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
TABLE II. Group B tests (Mechanical and environmental test) . – Continued.  
Group B tests for QML microcircuits  
(MIL-PRF-38535)  
Group B tests for class level B and S microcircuits  
(TM 5005 of MIL-STD-883)  
Subgroups  
1/  
Class Q  
Class V  
Class Y  
Class level B  
Class level S  
Subgroup 3  
sample size 22(0)  
(22 leads from 3 devices) +245°C ±5°C  
8/  
Solderability TM 2003 Solderability TM 2003  
Solderability TM 2003  
solder temperature  
+245°C ±5°C  
Solderability TM 2003  
solder temperature  
+245°C ±5°C  
Solderability TM 2003  
solder temperature  
+245°C ±5°C  
solder temperature  
solder temperature  
+245°C ±5°C  
Subgroup 4  
sample size 45(0)  
3/  
For BGA/CGA packages:  
For BGA/CGA packages:  
a. Lead integrity TM 2004 9/  
(Test condition B2, lead fatigue)  
(i) Ball shear test for BGA  
package - JESD22-B117  
(45 balls from 2 devices  
minimum)  
(i) Ball shear test for BGA  
package - JESD22-B117  
(45 balls from 2 devices  
minimum)  
b. Seal test TM 1014  
as applicable  
(1) Fine leak  
(2) Gross leak  
(ii) Solder column pull test for  
CGA package – TM 2038  
(45 columns from 2 devices  
minimum)  
(ii) Solder column pull test for  
CGA package - TM 2038  
(45 columns from 2 devices  
minimum)  
c. Lid torque TM 2024 10/  
as applicable  
d. For BGA/CGA packages:  
(i) Ball shear test for BGA  
package - JESD22-B117  
(45 balls from 2 devices  
minimum)  
(ii) Solder column pull test for  
CGA package – TM 2038  
(45 columns from 2 devices  
minimum)  
25  
 
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