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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
TABLE IB. Tests/monitors for plastic packages. 1/  
Test/monitor  
MIL-STD-883 test method (TM) or industry standard  
1. Wafer acceptance  
2. Internal visual  
TRB / QM plan (see H.3.2.1.4)  
TM 2010 or in accordance with manufacturers internal procedures  
3. Temperature cycling/thermal shock  
4. Resistance to solvents  
5. Bond strength  
TM 1010/TM 1011  
TM 2015  
TM 2011  
6. Ball shear  
ASTM F1269  
TM 2003  
7. Solderability  
8. Die shear or stud pull  
TM 2019 or TM 2027  
9. Steady-state life test  
End-point electricals  
TM 1005  
In accordance with device specification  
10. Physical dimensions  
11. Lead integrity  
TM 2016  
TM 2004  
e.g., TM 1034 (dye penetrant test), cross-sectioning, C-mode  
scanning acoustical microscopy (CSAM) TM 2030, etc.  
12. Inspection for delamination  
JESD22-A118,  
100 hours, +130°C, 85% relative humidity (RH) 2/  
13. Highly accelerated stress testing (HAST)  
14. Autoclave  
JESD 22-A102 (no bias) 2 atm., +121°C  
TM 1009  
15. Salt atmosphere  
16. Adhesion to lead finish  
17. Interim pre burn-in electricals  
18. Burn-in test  
TM 2025  
In accordance with device specification  
TM 1015, 160 hours at +125°C or manufacturers QM plan  
In accordance with device specification  
1% PDA or manufacturer's QM plan  
19. Interim post burn-in electricals  
20. PDA or alternate procedure for lot acceptance  
21. Final electrical tests (see table III, herein, for  
definition of subgroups)  
a. static test  
In accordance with device specification  
b. dynamic test  
c. functional test  
d. switching test  
22. External visual inspection test  
TM 2009 or JESD22-B101 or manufacturers internal procedures  
1/ Test methods (TMs) are listed herein to give the manufacturer an available method to use. Alternate procedures and test  
methods may be used. Monitor frequency and sample plan shall be in accordance with manufacturer's QM plan.  
2/ An alternate process monitor may be used; e.g., +85°C/85% relative humidity (RH).  
23  
 
 
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