欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
 浏览型号5962-0421901QYC的Datasheet PDF文件第34页浏览型号5962-0421901QYC的Datasheet PDF文件第35页浏览型号5962-0421901QYC的Datasheet PDF文件第36页浏览型号5962-0421901QYC的Datasheet PDF文件第37页浏览型号5962-0421901QYC的Datasheet PDF文件第39页浏览型号5962-0421901QYC的Datasheet PDF文件第40页浏览型号5962-0421901QYC的Datasheet PDF文件第41页浏览型号5962-0421901QYC的Datasheet PDF文件第42页  
MIL-PRF-38535K  
TABLE II. Group B tests (Mechanical and environmental test)  
Group B tests for QML microcircuits  
Group B tests for class level B and S microcircuits  
(TM 5005 of MIL-STD-883)  
Subgroups  
1/  
(MIL-PRF-38535)  
Class Q  
Class V  
Class Y  
Class level B  
Class level S  
Subgroup 1  
Resistance to solvents 2/  
TM 2015 3(0)  
Resistance to solvents 2/  
TM 2015 3(0)  
Resistance to solvents 2/  
TM 2015 3(0)  
a. Physical dimensions  
3/  
TM 2016  
b. Internal water vapor content  
TM 1018 3(0) 3/ 4/ 5/  
2(0)  
(5,000 ppm maximum water  
content at 100°C)  
Subgroup 2  
a. Bond strength  
7/  
a. Bond strength  
7/  
a. Bond strength 7/  
a. Resistance to  
solvents 2/  
a. Resistance to solvents 2/  
TM 2015 3(0)  
6/  
TM 2011 22(0)  
TM 2011 22(0)  
TM 2011  
22(0)  
(1) Thermo compression -  
Test condition C or D  
(2) Ultrasonic -  
(1) Thermo compression -  
Test condition C or D  
(2) Ultrasonic -  
(1) Thermo compression -  
Test condition C or D  
(2) Ultrasonic -  
TM 2015 3(0)  
b. Internal visual and mechanical  
TM 2013, TM 2014 2(0)  
c. Bond strength 7/  
Test condition C or D  
(3) Beam lead - Test condition H  
Test condition C or D  
(3) Beam lead - Test condition H  
Test condition C or D  
(3) Beam lead - Test condition H  
TM 2011  
22(0)  
(1) Thermo compression -  
Test condition C or D  
(2) Ultrasonic -  
Test condition C or D  
(3) Beam lead - Test condition H  
b. Die shear test or substrate  
attach strength or stud pull test  
including passive elements  
TM 2019 or TM 2027 3(0)  
b. Die shear test or substrate  
attach strength or stud pull test  
including passive elements  
TM 2019 or TM 2027 3(0)  
b. Die shear test or substrate  
attach strength or stud pull test  
including passive elements  
TM 2019 or TM 2027 3(0)  
d. Die shear test or substrate  
attach strength or stud pull test  
including passive elements  
TM 2019 or TM 2027 3(0)  
c. Flip chip pull off test  
TM 2031 or TM 2011 2(0)  
c. Flip chip pull off test  
TM 2031 or TM 2011 2(0)  
c. Flip chip pull off test  
TM 2031 or TM 2011 2(0)  
d. Flip chip die shear strength  
test or substrate attach  
strength test (test perform post  
underfill cure)  
d. Flip chip die shear strength  
test or substrate attach  
strength test (test perform post  
underfill cure)  
d. Flip chip die shear strength  
test or substrate attach  
strength test (test perform post  
underfill cure)  
e. Flip chip pull off test  
TM 2031 or TM 2011 2(0)  
TM 2019 or TM 2027 3(0)  
TM 2019 or TM 2027 3(0)  
TM 2019 or TM 2027 3(0)  
f. Flip chip die shear strength test  
or substrate attach strength test  
(test perform post underfill cure)  
TM 2019 or TM 2027 3(0)  
24  
 
 复制成功!