MIL-PRF-38535K
4. VERIFICATION
4.1 Verification. A verification system shall be in place to verify the requirements of section 3 in accordance with
appendix J. Any screen or TCI test prescribed herein may be reduced, modified, moved, or eliminated by the QML
manufacturer provided the product is still capable of meeting the screening and TCI testing groups A, B, C, D, and E for the
applicable detail specification as approved by the QA.
4.2 Screening. All QML integrated circuits shall meet the requirements of the screens specified in tables IA and IB herein of
the specification whether or not the actual testing has been performed. The procedures and accept and reject criteria for the
screens shall have been certified by the QA. With QA approval the requirements of test method 5004 of MIL-STD-883 may be
substituted for the screening requirements herein. When using TM 5004, class Q shall meet the requirements of the class
level B screening flow whether or not the actual testing has been performed and class V and class Y shall meet the
requirements of the class level S screening flow and appendix B herein whether or not the actual testing has been performed.
The manufacturer, through its TRB, shall identify which tests are applicable to guarantee the quality and reliability of the
associated technology or end product (e.g., wafer or die product, packaged product, plastic, etc.). The manufacturer may elect
to eliminate or modify a screen based on supporting data that indicates that for the QML technology, the change is justified
(see J.3.12 herein). If such a change is implemented, the manufacturer is still responsible for providing product that meets all
of the performance, quality, and reliability requirements herein.
4.2.1 Screen testing failures. Devices that fail any screen test shall be identified, segregated, or removed.
4.2.2 Screening resubmission criteria. When it has been established that a failure during screening tests is due to operator
error or equipment failure and it has been established that the remaining QML microcircuits have not been damaged or
degraded, the surviving microcircuits, may be resubmitted to the corrected screening test(s) in which the error occurred.
Failures verified as having been caused by test equipment failure or operator error shall not be counted in the percent
defective allowable (PDA) calculation (when applicable). ESD failures shall be counted as rejects and shall not be attributed to
equipment failure or operator error.
4.2.3 Electrostatic discharge (ESD) sensitivity. ESD sensitivity testing shall be done in accordance with TM 3015 of
MIL-STD-883 and the device specification. The testing procedure defined within JESD22-A114 may be used as an option in
lieu of TM 3015 provided the manufacturer is able to demonstrate correlation between the two methods. In addition, the
reported sensitivity classification levels shall be the ones defined within TM 3015 of MIL-STD-883 (see 3.6.7.2). In addition,
unless otherwise specified, tests shall be performed for initial qualification and product redesign as a minimum.
4.3 Technology conformance inspection (TCI). All product shipped shall be capable of passing TCI in accordance with
tables II, III, IV, and V; for plastic packages see table IB herein. With QA approval when TM 5005 of MIL-STD-883 is used as
a TCI option, class Q shall be capable of passing the class level B flow. Both class V and class Y shall be capable of passing
the flow of class level S and Appendix B herein. When selecting the TM 5005 TCI option for class V and class Y, the group B
end-point electricals shall be the same as the group C end-point electricals, unless otherwise specified in the acquisition
document. TCI testing shall be accomplished by the manufacturer on a periodic basis to assure that the manufacturer's
quality, reliability, and performance capabilities meet the requirements of the QM plan (see G.3.3). Where appropriate, as an
option, in place of the fixed sample size (Acceptance number) the manufacturer may use the sample size series (SSS) plan of
appendix D.
4.4 Qualification inspection. Qualification inspection shall be performed in accordance with H.3.4.
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