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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
3.6.3.2 “JAN” or “J” mark. The "J" marking is a legacy certification mark that was required by MIL-M-38510 device  
specifications and qualified on a QPL part by part basis. Since the “J” is often mistakenly considered part of the PIN, it may  
continue to be marked in front of the military designator portion of the device specification part number at the QML vendor’s  
option. This "J" was not and shall not be considered an element of the official part number used to assign a national stock  
number.  
3.6.4 Manufacturer's identification. Microcircuits shall, as a minimum, identify the manufacturer by the marking of name or  
trademark of the manufacturer or the manufacturer may also mark the manufacturer's Commercial and Government Entity  
(CAGE) code. The identification of the equipment manufacturer may appear on the microcircuit only if the equipment  
manufacturer is also the microcircuit manufacturer. If the microcircuit manufacturer's designating symbol or CAGE code  
number is marked, it shall be as assigned by the Defense Logistics Information Service (DLIS). The designating symbol shall  
be used only by the manufacturer to whom it has been assigned and only on those devices manufactured at that  
manufacturer's plant. In the case of small microcircuits, the manufacturer's designating symbol may be abbreviated by  
omitting the first "C" in the series of letters.  
3.6.4.1 Code for assembly sites. If the manufacturer has more than one offshore facility for assembly in a given country, a  
unique single letter code shall be assigned for the assembly sites used. This code shall be marked on the device immediately  
preceding or immediately after the date code. The assembly codes and the full address shall be included in the QML.  
3.6.5 Country of origin. The name of the country of assembly or an appropriate abbreviation shall be marked in small  
characters below or adjacent to the other marking specified. Backside marking of the country of origin information is  
permitted.  
3.6.6 Date code. Microcircuits shall be marked with a unique code to identify the first or the last week of the period (6  
weeks maximum) during which devices in that inspection lot were sealed. The first two numbers in the code shall be the last  
two digits of the number of the year, and the third and fourth numbers shall be two digits indicating the calendar week of the  
year.  
3.6.7 Marking location and sequence. The QML certification mark, the PIN, the date code, and ESD identifier, if applicable  
(see 3.6.7.2), shall be located on the top surface of leadless or leaded chip carriers, pin grid array packages, flat packages or  
dual-in-line configurations and on either the top or the side of cylindrical packages (TO configurations and similar  
configurations). When the size of a package is insufficient to allow marking of special process identifiers on the top surface,  
the backside of the package may be used for these markings except the ESD identifier, if applicable, which shall be marked on  
the top. Button cap flat packs with less than or equal to 16 leads may have the identifier marked on the ceramic. Backside  
marking with conductive or resistive ink shall be prohibited. For unpackaged die, marking is to be located on the container.  
3.6.7.1 Beryllium oxide package identifier. If a microcircuit package contains beryllium oxide, the part shall be marked with  
the designation "BeO".  
3.6.7.2 Electrostatic discharge (ESD) sensitivity identifier. Individual microcircuit ESD classification marking is not required.  
The manufacturer shall have an option of no ESD marking, marking a single ESD triangle or marking in accordance with the  
ESD device classification defined in test method (TM) 3015 of MIL-STD-883. Because it may no longer be possible to  
determine the ESD classification from the part marking, the Device Discharge Sensitivity classification shall have to be  
obtained through MIL-HDBK-103 or QML-38535.  
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