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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
3.6.2.1 RHA designator. A "- or /" indicates no radiation hardness assurance. Letters M, D, P, L, R, F, G, or H designations  
are defined RHA level in (rad(Si)) (see 3.4.3.).  
3.6.2.2 Drawing designator. The first two characters of the designator shall consist of the last two digits of the year; the last  
three characters shall consist of unique characters assigned to the drawing by DLA Land and Maritime.  
3.6.2.2.1 Military designator. The M38510 military designator for microcircuits means a "MIL" specification item produced in  
full compliance with this specification including qualification, and the device specification. Any device which does not meet all  
the requirements of this specification and the device specification shall not be marked M38510 and shall not make reference to  
MIL-PRF-38535.  
NOTE: The military designator is optional for leadless chip carrier outlines that have a surface area smaller than the C-10  
package.  
3.6.2.3 Device class designator. The device class shall be designated by a single letter identifying the quality assurance  
level. For example:  
Example PIN  
under new system  
Manufacturing  
source listing  
Document  
listing  
Military documentation format  
MIL-PRF-38535  
SMDs  
5962-XXXXXZZ(M, N, Q, V, Y, T (B or S))YY QML-38535  
(see 6.4.27 through 6.4.34)  
MIL-HDBK-103  
MIL-HDBK-103  
1.2.1 of MIL-STD-883  
SMDs  
5962-XXXXXZZ(M)YY  
MIL-HDBK-103  
(see 6.4.27 through 6.4.33)  
3.6.2.4 Case outline. The case outline shall be designated by a single letter assigned to each outline within each device  
specification.  
3.6.2.5 Lead finish. The lead finish (see A.3.5.6.3.2) shall be designated by a single letter as follows:  
Finish letter  
Process  
A
B
C
D
E
F
Hot solder dip  
Tin-lead plate  
Gold plate  
Palladium  
Gold flash palladium  
Tin-lead alloy as defined in the applicable device document.  
Either A, B, or C (mark on specification only)  
X
NOTE: Lead finishes D and E are equivalent, and one may be substituted for the other, at the manufacturer’s option.  
3.6.3 Certification mark. All microcircuits acquired to and meeting the requirements of this specification and the applicable  
SMD, device specification, or military temperature range data book parts, which are approved for supply under QML, shall  
bear the "QML" or "Q" certification mark. The certification marks “Q", or "QML" shall be visibly separate and distinct from all  
other markings on microcircuits package.  
3.6.3.1 “QD” certification mark. QML manufacturers shall request QA approval for diminishing manufacturing sources  
(DMS) product using the alternate die/fabrication requirements of A.3.2.2 or other alternatives. Upon approval the  
manufacturer shall use the “QD” certification mark in lieu of the “Q” or “QML” mark. The certification mark “QD” shall be visibly  
separate and distinct from all other markings on microcircuits package.  
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