MIL-PRF-38535K
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits.
MIL-STD-883, test method (TM) and conditions
Screening Tests
Class Q
Class V
Class Y
(class level B)
(class level S)
(class level S)
1. Wafer lot acceptance test
QM plan (see H.3.2.1.4) 1/
QM plan (see H.3.2.1.4) 1/
QM plan
(see H.3.2.1.4) 1/
or
or
TM 5007 of MIL-STD-883
(all lots)
TM 5007 of MIL-STD-883
(all lots)
2. Nondestructive bond pull (NDBP) test
2/
TM 2023
TM 2023
TM 2010, condition B
TM 2010, condition A
TM 2010, condition A
3. Internal visual inspection
3/
4. Temperature cycling
4/
TM 1010, condition C,
10 cycles minimum
TM 1010, condition C,
10 cycles minimum
TM 1010, condition C,
10 cycles minimum
5. Constant acceleration 5/
TM 2001, condition E
(minimum), Y1 orientation
only
TM 2001, condition E
(minimum), Y1 orientation
only
TM 2001, condition E
(minimum), Y1 orientation
only
6. Visual inspection
6/
100%
100%
100%
7. Particle Impact Noise Detection
TM 2020, test condition A
on each device
TM 2020, test condition A
on each device
(PIND) test
7/ 8/
9/
8. Serialization
In accordance with device In accordance with device
specification (100%) specification (100%)
In accordance with device
specification (100%)
9. Pre burn-in (Interim) electrical
In accordance with device In accordance with device
In accordance with device
specification 12/
parameters test
10/
specification 11/
specification 12/
10. Burn-in test:
10/ 13/ 14/
TM 1015
160 hours at +125°C
minimum
TM 1015
240 hours at 125°C,
condition D 15/
TM 1015
240 hours at 125°C ,
condition D 15/
11. Post burn-in (Interim) electrical
parameters test 10/
In accordance with device
specification 12/
In accordance with device
specification 12/
12. Reverse bias burn-in test
(Static burn-in)
TM 1015, Condition A or C;
144 hours at +125°C or
TM 1015, Condition A or C;
144 hours at +125°C or
13/ 14/ 16/
72 hours at +150°C minimum 72 hours at +150°C minimum
13. Post burn-in (Interim-reverse bias)
electrical parameters test 10/
In accordance with device
specification 12/
In accordance with device
specification 12/
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