欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962-0421901QUA 参数 Datasheet PDF下载

5962-0421901QUA图片预览
型号: 5962-0421901QUA
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, CMOS, CPGA624, CERAMIC, CGA-624]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
 浏览型号5962-0421901QUA的Datasheet PDF文件第166页浏览型号5962-0421901QUA的Datasheet PDF文件第167页浏览型号5962-0421901QUA的Datasheet PDF文件第168页浏览型号5962-0421901QUA的Datasheet PDF文件第169页浏览型号5962-0421901QUA的Datasheet PDF文件第171页浏览型号5962-0421901QUA的Datasheet PDF文件第172页浏览型号5962-0421901QUA的Datasheet PDF文件第173页浏览型号5962-0421901QUA的Datasheet PDF文件第174页  
MIL-PRF-38535K  
APPENDIX H  
e. Physical design.  
(1) Foundry physical design guidelines – Handoff to design team  
(2) Placement based on partitioning, architecture, I/O location.  
(3) Static timing analysis, with iterated placement, cell sizing and routing to achieve timing closure.  
f. Release to foundry.  
(1) Foundry run rule checks  
(2) Critical design/final design review, utilizing foundry checklists.  
H.3.2.1.1.3 Package Design. Packages used for QML microcircuits should address the design requirements and  
performance characteristics herein. Characterization may be performed by the microcircuit manufacturer, by an external  
lab, or by the package supplier. In any case, the manufacturer's assembly of QML microcircuits should address all the  
testing requirements herein. The manufacturer shall address package design/construction quality and reliability. The  
manufacturer is responsible to maintain documented validation of all characterization methods used, including all  
supporting data.  
a. Thermal characterization. The thermal resistance should be determined for all packages used in the manufacture  
of QML parts. This value may be obtained by direct or indirect measurements, or by simulation tools or  
calculations. TM 1012 of MIL-STD-883 may be used for this calculation. If the thermal resistance is obtained by a  
calculation or simulation tool, this procedure should be certified. To certify such a method of theoretical  
estimation, the manufacturer shall demonstrate a correlation between the theoretically estimated value and the  
actual measured value for at least one package of the same style with equal or greater pin count.  
b. Electrical characterization. The following electrical characterization parameters should be addressed:  
(1) Ground and power supply impedance. Packages used in the manufacture of QML microcircuits should be  
minimal contributors to ground and power supply noise. The above requirement can be met either through  
the use of documented package design rules or through testing of the packages, either individually or by  
similarity, in accordance with TM 3019 of MIL-STD-883.  
(2) Cross-coupling effects. Cross-coupling of wideband digital signals and noise between pins in packages used  
for digital QML microcircuits should be minimized. The above requirement can be met either through the use  
of documented package design rules or through testing the packages, either individually or by similarity, in  
accordance with TM 3017 and TM 3018 of MIL-STD-883.  
(3) High voltage effects. The voltage applied to a QML package should not produce a surface or bulk leakage  
between adjacent package conductors (including leads or terminals). The above requirement can be met  
either through the use of documented high voltage package design rules aimed at minimizing bulk or surface  
leakage, or through testing of the high voltage packages, either individually or by similarity, in accordance  
with TM 1003 of MIL-STD-883.  
c. Mechanical characterization. The manufacturer shall perform package mechanical characterization tests which  
includes evaluation for shock and vibration to demonstrate the capability to withstand impacts due to moisture  
ingression, contamination, corrosion, etc.  
156  
 
 
 复制成功!