3.2.1.3 Solderability test for case outlines Y and M. Solderability test for case outlines Y and M (LGA) is based on J-STD-
002, Test S (Surface Mount Process Simulation Test) with water soluble flux. This is the test method to simulate the solder
column attachment process. Test B (dip and look) with steam preconditioning per Method 2003 of MIL-STD-883 does not
provide any guidance for LGA devices.
3.2.1.4 Solderability test for case outlines Z, T, and N. Solderability test for case outlines Z, T, and N (CGA) package has
been verified during solder column attachment process. Method 2003 of MIL-STD-883 solderability test does not provide any
guidance for CGA devices. Devices on this SMD in a CGA package have high lead content (case outline Z has 90% lead
content and case outlines T and N has 80% lead content vs. typical eutectic solder's 37% lead content, see Figure 1 for details).
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s).
3.2.3.1 Unprogrammed devices. The truth table or test vectors for unprogrammed devices for contracts involving no altered
item drawing is not part of this drawing. When required in screening (see 4.2 herein) or qualification conformance inspection,
groups A, B, C, D, or E (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test. A minimum of 95
percent of the total number of logic modules shall be utilized.
3.2.3.2 Programmed devices. Prior to submitting altered item drawing the truth table or test vectors for programmed devices
should be agreed upon by acquiring activity and the manufacturer.
3.2.4 Logic blocks diagrams. The logic block diagrams and switching test circuit diagrams are specified in figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
junction operating temperature (TJ) range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
5962-04221
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
7
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
