g. Devices built with case outlines Z, T, and N are equivalent to the same device built with case outline Y and M plus the
solder column attachment. All required screening for devices built with case outline Z, T, and N are processed prior to
the solder column attachment (same as case outline Y and M). After solder column attachment, Group A subgroups 1
and 7 shall be performed to verify device functionality.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). Qualification inspection for all devices (01 to 08) complies with class Q
level requirements only.
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device
class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for
device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4). Conformance inspection for devices 03, 04, 07, and 08 comply with class Q level requirement only,
wafer lot specific group C inspection may be conducted under contract with acquiring activities.
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (C and C
IN OUT
measurements) shall be measured only for initial qualification and after any process or
design changes which may affect input or output capacitance. Capacitance shall be measured between the designated
terminal and GND at a frequency equal or less than 1 MHz. Sample size is on a minimum of three devices with no
failures on a minimum of five worst case pins from each device.
d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may
affect the performance of the device. For device class M, procedures and circuits shall be maintained under document
revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity
upon request. For device classes Q and V, the procedures and circuits shall be under the control of the device
manufacturer's technical review board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the
preparing activity or acquiring activity upon request. Testing shall be on all pins, on a minimum of three devices with
zero failures. Latch-up test shall be considered destructive. Information contained in JEDEC Standard EIA/JESD78
may be used for reference.
e. Programmed device (see 3.2.3.2) - For device class M, subgroups 7, 8A, and 8B tests shall consist of verifying the
functionality of the device. For device classes Q and V, subgroups 7, 8A, and 8B shall include verifying the
functionality of the device.
f. Unprogrammed devices shall be tested for programmability and dc and ac performance compliance to the requirements
of group A, subgroups 1 and 7. The programming procedure used and the data generated shall be maintained by the
device manufacturer and shall be made available to the preparing or acquiring activities.
Note: The following steps are done prior to burn-in screening.
(1) Programming requirements shall be based on wafer lot and the Enhanced Lot Acceptance (ELA) design shall be
used. Sample size shall achieve 14 programmed devices with the maximum of five allowable programming failures
19(5). In the occurrence of six or more programming failures, the wafer lot shall be put on hold until its
programmability can be resolved, otherwise, the wafer lot shall be designated to be programmed by manufacturer
only and be delivered to acquiring activities accepting lower programming yield.
Note: Programming reliability is determined by programming algorithm (see 4.6 below), all parts passed programming
shall be considered as reliable since it is verified with ELA; and programming yield shall not be used as a reliability
indicator. Field programming yield can not be guaranteed, and manufacturer will replace all field programming rejects
when the provided manufacturer's programming procedure is followed.
(2) Retesting of devices due to failure shall be in accordance with the manufacture’s Quality Control Monitor (QCMON)
for the purpose of determining the failure as True or False as defined in the QCMON.
SIZE
STANDARD
5962-04221
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
9
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
