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73S8004R-ILF 参数 Datasheet PDF下载

73S8004R-ILF图片预览
型号: 73S8004R-ILF
PDF下载: 下载PDF文件 查看货源
内容描述: [Microprocessor Circuit, PDSO28,]
分类和应用: 光电二极管外围集成电路
文件页数/大小: 18 页 / 298 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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73S8004R  
Low Cost Smart Card Interface  
CMDVCC  
VCC  
I/O  
CLK  
RSTIN  
RST  
t1  
t3  
t4  
t2  
Figure 2: Activation Sequence – Timing Diagram #1  
t1 = 0.510 ms (timing by 1.5MHz internal Oscillator)  
t2 = 1.5µs, I/O goes to reception state  
t3 = >0.5µs, CLK starts  
t4 = 42000 card clock cycles. Time for RST to become the copy of RSTIN  
The following steps show the activation sequence and the timing of the card control signals when the system  
controller pulls the CMDVCC low while the RSTIN is high:  
-
-
CMDVCC is asserted low.  
Next, the internal VCC control circuit checks the presence of VCC during t1. In normal operation, the  
voltage VCC to the card becomes valid during this time. If not, OFF goes low to report a fault to the  
system controller, and the power VCC to the card is de-asserted.  
-
-
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Turn I/O (AUX1, AUX2) to reception mode at the end of (t2) due to fall of RSTIN.  
CLK is applied to the card at the end of (t3).  
RST is to be a copy of RSTIN after (t4). If RSTIN is high prior to t4, RST will de-assert at t4.  
CMDVCC  
VCC  
I/O  
CLK  
RSTIN  
RST  
t3  
t1  
t2  
t4  
Figure 3: Activation Sequence – Timing Diagram #2  
t1 = 0.510 ms (timing by 1.5MHz internal Oscillator)  
t2 = 1.5µs, I/O goes to reception state  
t3 = > 0.5µs, CLK active  
t4 = 42000 card clock cycles. Time for RST to become the copy of RSTIN  
Page 7  
© 2002-2003 TDK Semiconductor Corporation  
Proprietary and Confidential  
Rev 1.1