SI-8000W Series
■External Dimensions (SOP8)
(Unit : mm)
5.1±0.4
1.27
+0.1
0.4±0.1
0.15
–0.05
Pin Assignment
q VIN
8
1
7
6
3
5
4
w N.C
e SW
r VOS
t GND
y GND
u GND
i GND
2
1.27
0.995max.
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
0.10
0.4±0.1
0.12 M
■Typical Connection Diagram
■Block Diagram
V
IN
1
3
SW
L1
OCP
200µH
Reg.
1
3
4
VO
SW
VOS
VIN
VIN
OSC
Reset
Comp.
TSD
SI-8000W
Drive
D1
+
+
GND
C1
100µF
C2
330µF
5 to 8
SJPB-D4
(Sanken)
4
V
OS
Amp.
GND
GND
VREF
5
to 8
GND
■Reference Data
Copper Laminate Area vs. Power Dissipation
Copper Laminate Area vs. Thermal Resistance θj-a
Tj=100°C Area of PC board : 40 × 40mm
Area of PC board : 40 × 40mm
140
1.2
Ta=25°C
Ta=50°C
1
120
Ta=80°C
0.8
100
θ
0.6
0.4
80
60
40
0.2
0
10
100
1000
10
100
1000
Copper Laminate Area (mm2)
(GND Terminal)
Copper Laminate Area (mm2)
(GND Terminal)
ICs
15
ETC [ ETC ]
