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LC5200D 参数 Datasheet PDF下载

LC5200D图片预览
型号: LC5200D
PDF下载: 下载PDF文件 查看货源
内容描述: SANKEN半导体 [SANKEN SEMICONDUCTORS]
分类和应用: 半导体
文件页数/大小: 226 页 / 4860 K
品牌: ETC [ ETC ]
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1-1-3 DC/DC Converter ICs  
Application Note  
Heat Dissipation and Reliability  
Mounting Torque  
The reliability of an IC is highly dependent on its operating temperature.  
Please be sure to apply silicone grease to the IC and to mount it to the  
heatsink with a proper mounting torque.  
SI-8000E  
SI-8000JF  
SI-8000S  
Heatsink design should pay particular attention to ensuring sufficient heat  
dissipation capacity.  
SI-8000TFE  
SI-8000HFE  
SI-8000FFE  
SI-8000Y  
0.588 to 0.686[N•m] (6.0 to 7.0[kgf•cm])  
In addition, please take into account the air convection in operation.  
The reliability of discrete components such as capacitors and coils is  
closely related to temperature. A high operating temperature may reduce  
the service life. Exceeding the allowable temperature may burn the coils or  
damage capacitors. It is important to make sure that the temperature of  
output smoothing coils and input/output capacitors do not exceed their  
allowable levels during operation. With an adequate derating for the coils,  
minimize heat emission as far as possible. (For discrete components, refer  
to the individual user manuals.)  
Recommended Silicone Grease  
• Shin-Etsu Chemical Co., Ltd.: G746  
• Momentive Performance Materials Inc.: YG-6260  
• Dow Corning Toray Silicone Co., Ltd.: SC102  
Please select proper silicone grease carefully since the oil in some grease  
products may penetrate the device and result in an extremely short device  
life.  
Internal Power Dissipation  
PD can be obtained from the following formula.  
• For the device with built-in flywheel diode:  
Others  
100  
ηχ  
• Devices can not be operated in parallel connection aiming for a larger  
current.  
PD=VO•IO (  
–1)  
• Not applicable for the current boost or voltage step-up use.  
• For the device with external flywheel diode:  
100  
ηχ  
VO  
VIN  
PD=VO•IO (  
–1)–VF•IO(1–  
)
Rectifier Diodes for Power Supplies  
To rectify the AC input using rectifier diodes in power supplies, please use  
SANKEN rectifier diodes shown in the following list. (Please use a center-  
tap or bridge configuration in using stand-alone type diodes.)  
Efficiency ηχ depends on the input/output conditions. Please refer to  
the efficiency characteristics of the devices. (Posted on the Web site.)  
VO :  
VIN:  
Output voltage  
Input voltage  
Series Name  
SAI Series  
Diodes  
IO  
:
Output current  
Efficiency(%)  
SI-8000W Series  
SI-8000JD Series  
SI-8000TM Series  
SI-8000SD Series  
SPI-8000A Series  
SI-8005Q Series  
SI-8001FDE Series  
SI-8001FDL Series  
SI-8008HD Series  
SI-8000E Series  
SI-8000JF Series  
SI-8000TFE Series  
SI-8000GL Series  
SI-8000S Series  
SI-8100QL Series  
SI-8000FFE Series  
SI-8000HFE Series  
SI-8000Y Series  
SI-8205NHD Series  
STA801M Series  
SI-8400L Series  
ηχ :  
VF :  
Diode forward voltage  
SJPM-H4 (Surface-Mount Stand-Alone Type,  
VRM=400V,Io=2.0A)  
Thermal Design  
FMM-22S,R (Center-tap Type,VRM=200V,IO=10 A)  
AM01Z (Axial Type,VRM=200V,Io=1.0A)  
The maximum junction temperature Tj(max) given in the Absolute Maximum  
Ratings is specific to each product type and must be strictly observed.  
Thus, thermal design must consider the maximum power dissipation  
PD(max), which varies by the conditions of use, and the maximum ambient  
temperature Ta(max).  
RM10Z (Axial Type,VRM=200V,Io=1.5A)  
RM4Z (Axial Type,VRM=200V,Io=3.0A)  
To simplify thermal design, Ta-PD characteristic graphs are provided herein.  
Please observe the following steps for heatsink design:  
1. Obtain the maximum ambient temperature Ta(max).  
FMM-22S,R (Center-tap Type,VRM=200 V,IO=10 A)  
RM10Z (Axial Type,VRM=200V,Io=1.5A)  
AM01Z (Axial Type,VRM=200V,Io=1.0A)  
2. Obtain the maximum power dissipation PD(max).  
3. Look for the intersection point on the Ta-PD characteristic graph and  
determine the size of the heatsink.  
AM01Z (Axial Type,VRM=200V,Io=1.0A)  
SI-8500L Series  
Although the heatsink size is now obtained, in actual applications, 10-to-  
20% derating factor is generally introduced. Moreover, the heat dissipation  
capacity of a heatsink highly depends on how it is mounted. Thus, it is  
recommended to measure the heatsink and case temperature in the actual  
operating environment.  
Please refer to the Ta-PD characteristic graphs for respective product  
types.  
ICs  
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