SAI Series
■External Dimensions (PS4)
(unit : mm)
2 SW
1VIN
3VOS
4
A Case Temperature Measuring Point
.GND
1.4±0.2
Pin Assignment
q VIN
6.8max.
3.6±0.2
4.0max.
w SWOUT
e VOS
8.0±0.5
6.3±0.2
A
r GND
Plastic Mold Package Type
Flammability: UL94V-0
0 to 0.15
Product Mass: Approx. 0.22g
3.0±0.2
9.8±0.3
1.0±0.3
■Typical Connection Diagram
■Block Diagram
VIN
1
2
SWOUT
3.3V 5V : 200µH
12V : 300µH
OCP
L1
2
Reg.
1
VO
SWOUT
V
IN
VIN
OSC
3
Reset
Amp.
TSD
V
OS
SAI
Drive
D1
Comp.
+
+
GND
4
C
100µF
1
C2
330µF
SJPB-D4
(Sanken)
3
VOS
GND
GND
VREF
4
GND
■Ta-PD Characteristics
100
VO
PD=VO•IO
–1 –VF•IO 1–
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
ηχ
VIN
• Glass epoxy
board
(95×69×1.2)
The efficiency depends on the input voltage and the output
current. Therefore, obtain the value from the efficiency graph
and substitute the percentage in the formula above.
• Natural air cooling
VO :Output voltage
IO :Output current
ηχ :Efficiency (%)
VF :Diode D1 forward voltage
SJPB-D4-0.3V
–30
0
25
50
75
100
125
Thermal design for D1 must be considered separately.
Ambient Temperature T
a
(°C)
ICs
13
ETC [ ETC ]
