SI-8000JD Series
■External Dimensions (TO263-5)
(Unit : mm)
Case temperature
measurement point
0.2
10.0
(8.0)
(4.4)
(15°)
0.2
4.5
+0.10
–0.05
1.3
3-R0.3
0.2
(2×R0.45)
(3°)
φ1.5 Dp:
Pin Assignment
q
w
e
r
t
VIN
0.15
0.10
(3°)
(3°)
SWOUT
GND
0.2
2.4
(R0.3)
VOS
0.10
0.25
0.88
(1.7
(R0.3)
0 to 6°
(0.5)
ON/OFF
0.1
0.1
0.8
(1.7
0.8
(1.7
0.25
0.25
0.25
)
(1.7
)
)
)
Plastic Mold Package Type
Flammability: 94V-0
1
2
3
4
5
0.2
9.9
(3°)
(3°)
2-R0.3
Product Mass: Approx. 1.48g
0.02
10.0
■Block Diagram
■Typical Connection Diagram
L1
1
2
4
V
OUT
SWOUT
VIN
VIN
SWOUT
1
5
VIN
2
VOS
SI-8000JD
PReg.
OCP
+
+
ON/OFF GND
C1
C2
ON/OFF
Di
5
3
Latch &
Drive
ON/OFF
Soft
Start
Reset
C3
OSC
GND
GND
+
–
TSD
C1 : 50V/220µF
C2 : 25V/470µF
4
Comp.
Error Amp.
+
–
C3 : 10V/0.47µF (Only when using soft-start function)
L1 : 100µH
VREF
GND
Di : SJPB-H6 (Sanken)
3
■Reference Data
Copper Laminate Area on Glass Epoxy Board vs.
Output Current vs. Power Dissipation (Typical)
Thermal Resistance (Junction to Ambient Air) (Typical Value)
55
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
With glass epoxy board of 40 × 40 mm
45
40V
40
θ
30V
20V
V
IN 8V
35
30
0
200
400
600
800
1000 1200 1400 1600 1800
Copper Laminate Area (mm2)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Output Current I
O
(A)
■Ta-PD Characteristics
3.5
Copper Area
100
VO
40×40 mm
PD=VO·IO
–1 –VF·IO 1–
(
θ
j-a : 33.3°C/W)
ηχ
VIN
3
2.5
2
20×40 mm
θ
(
j-a : 37°C/W)
The efficiency depends on the input voltage and the output current. Therefore, obtain the value
from the efficiency graph and substitute the percentage in the formula above.
20×20 mm
(
j-a :44°C/W)
θ
10×10 mm
(
j-a : 53°C/W)
θ
VO : Output Voltage
VIN : Input Voltage
1.5
1
IO : Output Current
ηχ : Efficiency (%)
VF : D1 forward voltage
0.4V(IO=2A)(SJPB-H6)
0.5
0
–25
0
25
50
75
100
125
Ambient Temperature T
a
(°C)
Thermal design for D1 must be considered separately.
ICs
17
ETC [ ETC ]
