ST6200C/ST6201C/ST6203C
12.2 THERMAL CHARACTERISTICS
Symbol
Ratings
Value
Unit
Package thermal resistance (junction to ambient)
DIP16
SO16
90
90
R
°C/W
thJA
SSOP16
125
1)
P
Power dissipation
500
150
mW
D
2)
T
Maximum junction temperature
°C
Jmax
Notes:
1. The power dissipation is obtained from the formula P = P + P
where P
is the chip internal power (I xV
)
D
INT
PORT
INT
DD DD
and P
is the port power dissipation determined by the user.
PORT
2. The average chip-junction temperature can be obtained from the formula T = T + P x RthJA.
J
A
D
91/104
1
ETC [ ETC ]
