ST6200C/ST6201C/ST6203C
12.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 78 and Figure 79.
Recommended glue for SMD plastic packages:
■ Heraeus: PD945, PD955
■ Loctite: 3615, 3298
Figure 78. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
COOLING PHASE
(ROOM TEMPERATURE)
5 sec
200
150
100
50
SOLDERING
PHASE
80°C
Temp. [°C]
PREHEATING
PHASE
Time [sec]
0
20
60
40
80
100
140
120
160
Figure 79. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
Tmax=220+/-5°C
for 25 sec
200
150
100
50
150 sec above 183°C
90 sec at 125°C
Temp. [°C]
ramp down natural
2°C/sec max
ramp up
2°C/sec for 50sec
Time [sec]
0
100
200
300
400
92/104
1
ETC [ ETC ]
