L9216B/H
Preliminary Data Sheet
September 2001
High-Voltage Ringing SLIC with Ground Start
Absolute Maximum Ratings (@ TA = 25 °C)
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Symbol
Min
–0.5
—
Typ
—
—
—
—
—
—
—
—
—
—
—
Max
7.0
Unit
V
dc Supply (VCC)
—
Battery Supply (VBAT1)
—
–85
V
Battery Supply (VBAT2)
—
—
VBAT1
VCC + 0.5
VCC + 0.5
125
V
Logic Input Voltage
—
–0.5
–0.5
–40
–40
5
V
Logic Output Voltage
—
—
V
Operating Temperature Range
Storage Temperature Range
Relative Humidity Range
°C
°C
%
V
—
150
—
95
PT or PR Fault Voltage (dc)
PT or PR Fault Voltage (10 x 1000 µs)
Ground Potential Difference (BGND to AGND)
VPT, VPR
VBAT – 5
3
VPT, VPR VBAT – 15
15
V
—
—
±1
V
Note: The IC can be damaged unless all ground connections are applied before, and removed after, all other connections. Furthermore, when
powering the device, the user must guarantee that no external potential creates a voltage on any pin of the device that exceeds the
device ratings. For example, inductance in a supply lead could resonate with the supply filter capacitor to cause a destructive overvolt-
age.
Table 4. Recommended Operating Characteristics
Parameter
5 V dc Supplies (VCC)
Min
—
Typ
5.0
3.3
–70
—
Max
5.25
—
Unit
V
3 V dc Supplies (VCC)
3.13
–60
–12
–40
V
High Office Battery Supply (VBAT1)
Auxiliary Office Battery Supply (VBAT2)
Operating Temperature Range
–85
VBAT1
85
V
V
25
°C
Table 5. Thermal Characteristics
Parameter
Min
Typ
Max
Unit
Thermal Protection Shutdown (Tjc)
150
165
—
°C
28 PLCC Thermal Resistance Junction to Ambient (θJA)1, 2
Natural Convection 2S2P Board
Natural Convection 2S0P Board
Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S2P Board
Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S0P Board
:
—
—
—
—
35.5
50.5
31.5
42.5
—
—
—
—
°C/W
°C/W
°C/W
°C/W
48 MLF Thermal Resistance Junction to Ambient (θJA)1, 2
:
—
38
—
°C/W
1. This parameter is not tested in production. It is guaranteed by design and device characterization.
2. Airflow, PCB board layers, and other factors can greatly affect this parameter.
Agere Systems Inc.
11
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
