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XC3S1600E-4FGG320C 参数 Datasheet PDF下载

XC3S1600E-4FGG320C图片预览
型号: XC3S1600E-4FGG320C
PDF下载: 下载PDF文件 查看货源
内容描述: 的Spartan- 3E FPGA系列 [Spartan-3E FPGA Family]
分类和应用: 现场可编程门阵列可编程逻辑时钟
文件页数/大小: 193 页 / 1733 K
品牌: XILINX [ XILINX, INC ]
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Functional Description  
ing for the SPI Flash device. Without examining the timing  
for a specific SPI Flash PROM, use ConfigRate = 12,  
which is approximately 12 MHz. SPI Flash PROMs that sup-  
port the FAST READ command support higher data rates.  
Some such PROMs support up to ConfigRate = 25 and  
beyond but require careful data sheet analysis.  
SPI Flash PROM Density Requirements  
Table 49 shows the smallest usable SPI Flash PROM to  
program a single Spartan-3E FPGA. Commercially avail-  
able SPI Flash PROMs range in density from 1 Mbit to 128  
Mbits. A multiple-FPGA daisy-chained application requires  
a SPI Flash PROM large enough to contain the sum of the  
FPGA file sizes. An application can also use a larger-den-  
sity SPI Flash PROM to hold additional data beyond just  
FPGA configuration data. For example, the SPI Flash  
PROM can also store application code for a MicroBlaze™  
RISC processor core integrated in the Spartan-3E FPGA.  
See Using the SPI Flash Interface after Configuration.  
Using the SPI Flash Interface after Configuration  
After the FPGA successfully completes configuration, all of  
the pins connected to the SPI Flash PROM are available as  
user-I/O pins.  
If not using the SPI Flash PROM after configuration, drive  
CSO_B High to disable the PROM. The MOSI, DIN, and  
CCLK pins are then available to the FPGA application.  
Table 49: Number of Bits to Program a Spartan-3E  
Because all the interface pins are user I/O after configura-  
tion, the FPGA application can continue to use the SPI  
Flash interface pins to communicate with the SPI Flash  
PROM, as shown in Figure 53. SPI Flash PROMs offer ran-  
dom-accessible, byte-addressable, read/write, non-volatile  
storage to the FPGA application.  
FPGA and Smallest SPI Flash PROM  
Number of  
Configuration  
Bits  
Smallest Usable  
SPI Flash PROM  
Device  
XC3S100E  
XC3S250E  
XC3S500E  
XC3S1200E  
XC3S1600E  
581,344  
1,352,192  
2,267,136  
3,832,320  
5,957,760  
1 Mbit  
2 Mbit  
4 Mbit  
4 Mbit  
8 Mbit  
SPI Flash PROMs are available in densities ranging from  
1 Mbit up to 128 Mbits. However, a single Spartan-3E FPGA  
requires less than 6 Mbits. If desired, use a larger SPI Flash  
PROM to contain additional non-volatile application data,  
such as MicroBlaze processor code, or other user data such  
as serial numbers and Ethernet MAC IDs. In the example  
shown in Figure 53, the FPGA configures from SPI Flash  
PROM. Then using FPGA logic after configuration, the  
FPGA copies MicroBlaze code from SPI Flash into external  
DDR SDRAM for code execution. Similarly, the FPGA appli-  
cation can store non-volatile application data within the SPI  
Flash PROM.  
CCLK Frequency  
In SPI Flash mode, the FPGA’s internal oscillator generates  
the configuration clock frequency. The FPGA provides this  
clock on its CCLK output pin, driving the PROM’s clock input  
pin. The FPGA starts configuration at its lowest frequency  
and increases its frequency for the remainder of the config-  
uration process if so specified in the configuration bitstream.  
The maximum frequency is specified using the ConfigRate  
bitstream generator option. The maximum frequency sup-  
ported by the FPGA configuration logic depends on the tim-  
The FPGA configuration data is stored starting at location 0.  
Store any additional data beginning in the next available SPI  
Flash PROM sector or page. Do not mix configuration data  
and user data in the same sector or page.  
DS312-2 (v1.1) March 21, 2005  
www.xilinx.com  
69  
Advance Product Specification  
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