R
Pinout Descriptions
mechanical dimensions of the standard and Pb-free pack-
ages are similar, as shown in the mechanical drawings pro-
vided in Table 4.
Package Overview
Table 2 shows the eight low-cost, space-saving production
package styles for the Spartan-3E family. Each package
style is available as a standard and an environmen-
tally-friendly lead-free (Pb-free) option. The Pb-free pack-
ages include an extra ‘G’ in the package style name. For
example, the standard "VQ100" package becomes
"VQG100" when ordered as the Pb-free option. The
Not all Spartan-3E densities are available in all packages.
For a specific package, however, there is a common foot-
print that supports all the devices available in that package.
See the footprint diagrams that follow.
Table 2: Spartan-3E Family Package Options
Maximum
I/O
Pitch
(mm)
Height
(mm)
Package
Leads
100
132
144
208
256
320
400
484
Type
Area (mm)
16 x 16
8 x 8
VQ100 / VQG100
CP132 / CPG132
TQ144 / TQG144
PQ208 / PQG208
FT256 / FTG256
FG320 / FGG320
FG400 / FGG400
FG484 / FGG484
Very-thin Quad Flat Pack (VQFP)
Chip-Scale Package (CSP)
66
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
1.20
1.10
1.60
4.10
1.55
2.00
2.60
2.60
92
Thin Quad Flat Pack (TQFP)
Plastic Quad Flat Pack (PQFP)
Fine-pitch, Thin Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
108
158
190
250
304
376
22 x 22
30.6 x 30.6
17 x 17
19 x 19
21 x 21
23 x 23
packages are superior in almost every other aspect, as
summarized in Table 3. Consequently, Xilinx recommends
using BGA packaging whenever possible.
Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 3: QFP and BGA Comparison
Characteristic
Quad Flat Pack (QFP)
Ball Grid Array (BGA)
Maximum User I/O
158
Good
Fair
376
Better
Better
Better
Better
6
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Limited
Fair
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
4
Possible
Difficult
DS312-4 (v1.1) March 21, 2005
www.xilinx.com
3
Advance Product Specification
XILINX [ XILINX, INC ]
