R
Spartan-IIE FPGA Family: Pinout Tables
Spartan-IIE family is not footprint compatible with any other
FPGA family. The following package-specific pinout tables
indicate function, pin, and bank information for all devices
available in that package. The pinouts follow the pad loca-
tions around the die, starting from pin 1 on the QFP pack-
ages.
Spartan-IIE Package Pinouts
The Spartan®-IIE family of FPGAs is available in five popu-
lar, low-cost packages, including plastic quad flat packs and
fine-pitch ball grid arrays. Family members have footprint
compatibility across devices provided in the same package,
with minor exceptions due to the smaller number of I/O in
smaller devices or due to LVDS/LVPECL pin pairing. The
Table 12: Spartan-IIE Family Package Options
(1)
Maximum Lead Pitch
Footprint
Height
(mm)
Mass
(g)
Package
Leads
Type
I/O
102
146
182
329
514
(mm)
Area (mm)
TQ144 / TQG144
PQ208 / PQG208
FT256 / FTG256
FG456 / FGG456
FG676 / FGG676
144
208
256
456
676
Thin Quad Flat Pack (TQFP)
0.5
22 x 22
30.6 x 30.6
17 x 17
1.60
3.70
1.55
2.60
2.60
1.4
5.3
1.0
2.2
3.1
Plastic Quad Flat Pack (PQFP)
Fine-pitch Thin Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
0.5
1.0
1.0
23 x 23
1.0
27 x 27
Notes:
1. Package mass is 10%.
Mechanical Drawings
Package Overview
Table 12 shows the five low-cost, space-saving production
package styles for the Spartan-IIE family.
Detailed mechanical drawings for each package type are
available from the Xilinx web site at the specified location in
Table 13.
Each package style is available in an environmentally
friendly lead-free (Pb-free) option. The Pb-free packages
include an extra ‘G’ in the package style name. For
example, the standard “TQ144” package becomes
“TQG144” when ordered as the Pb-free option. Leaded
(non-Pb-free) packages may be available for selected
devices, with the same pin-out and without the "G" in the
ordering code; contact Xilinx® sales for more information.
The mechanical dimensions of the standard and Pb-free
packages are similar, as shown in the mechanical drawings
provided in Table 13.
Material Declaration Data Sheets (MDDS) are also
available on the Xilinx web site for each package.
Table 13: Xilinx Package Documentation
Package
TQ144
Drawing
MDDS
Package Drawing
PK169_TQ144
PK126_TQG144
PK166_PQ208
PK123_PQG208
PK158_FT256
PK115_FTG256
PK154_FG456
PK109_FGG456
PK155_FG676
PK111_FGG676
TQG144
PQ208
Package Drawing
Package Drawing
Package Drawing
Package Drawing
PQG208
FT256
For additional package information, see UG112: Device
Package User Guide.
FTG256
FG456
FGG456
FG676
FGG676
DS077-4 (2.3) June 18, 2008
www.xilinx.com
55
Product Specification
XILINX [ XILINX, INC ]
