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DS312_09 参数 Datasheet PDF下载

DS312_09图片预览
型号: DS312_09
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内容描述: 的Spartan- 3E FPGA系列:介绍和订购信息 [Spartan-3E FPGA Family: Introduction and Ordering Information]
分类和应用:
文件页数/大小: 233 页 / 5527 K
品牌: XILINX [ XILINX, INC ]
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Functional Description  
shows the minimum required number of address lines  
between the FPGA and parallel Flash PROM. The actual  
number of address line required depends on the density of  
the attached parallel Flash PROM.  
parallel Flash PROM to hold additional data beyond just  
FPGA configuration data. For example, the parallel Flash  
PROM can also contain the application code for a MicroBlaze  
RISC processor core implemented within the Spartan-3E  
FPGA. After configuration, the MicroBlaze processor can  
execute directly from external Flash or can copy the code to  
other, faster system memory before executing the code.  
A multiple-FPGA daisy-chained application requires a paral-  
lel Flash PROM large enough to contain the sum of the  
FPGA file sizes. An application can also use a larger-density  
Table 60: Number of Bits to Program a Spartan-3E FPGA and Smallest Parallel Flash PROM  
Uncompressed  
File Sizes (bits)  
Smallest Usable  
Parallel Flash PROM  
Minimum Required  
Address Lines  
Spartan-3E FPGA  
XC3S100E  
581,344  
1,353,728  
2,270,208  
3,841,184  
5,969,696  
1 Mbit  
2 Mbit  
4 Mbit  
4 Mbit  
8 Mbit  
A[16:0]  
A[17:0]  
A[18:0]  
A[18:0]  
A[19:0]  
XC3S250E  
XC3S500E  
XC3S1200E  
XC3S1600E  
Compatible Flash Families  
Table 62: Maximum ConfigRate Settings for Parallel  
Flash PROMs (Commercial Temperature Range)  
The Spartan-3E BPI configuration interface operates with a  
wide variety of x8 or x8/x16 parallel NOR Flash devices.  
Table 61 provides a few Flash memory families that operate  
with the Spartan-3E BPI interface. Consult the data sheet  
for the desired parallel NOR Flash to determine its suitability  
The basic timing requirements and waveforms are provided  
in Byte Peripheral Interface (BPI) Configuration Timing  
(Module 3).  
Maximum ConfigRate  
Flash Read Access Time  
Setting  
250 ns  
115 ns  
45 ns  
3
6
12  
Table 62 shows the maximum ConfigRate settings for vari-  
ous typical PROM read access times over the Commercial  
temperature operating range. See Byte Peripheral Inter-  
face (BPI) Configuration Timing (Module 3) and UG332  
for more detailed information. Despite using slower  
ConfigRate settings, BPI mode is equally fast as the other  
configuration modes. In BPI mode, data is accessed at the  
ConfigRate frequency and internally serialized with an 8X  
clock frequency.  
Table 61: Compatible Parallel NOR Flash Families  
Flash Vendor  
Numonyx  
Flash Memory Family  
M29W, J3D StrataFlash  
AT29 / AT49  
Atmel  
Spansion  
Macronix  
S29  
MX29  
Using the BPI Interface after Configuration  
CCLK Frequency  
After the FPGA successfully completes configuration, all  
pins connected to the parallel Flash PROM are available as  
user I/Os.  
In BPI mode, the FPGA’s internal oscillator generates the  
configuration clock frequency that controls all the interface  
timing. The FPGA starts configuration at its lowest fre-  
quency and increases its frequency for the remainder of the  
configuration process if so specified in the configuration bit-  
stream. The maximum frequency is specified using the  
ConfigRate bitstream generator option.  
If not using the parallel Flash PROM after configuration,  
drive LDC0 High to disable the PROM’s chip-select input.  
The remainder of the BPI pins then become available to the  
FPGA application, including all 24 address lines, the eight  
data lines, and the LDC2, LDC1, and HDC control pins.  
Because all the interface pins are user I/Os after configura-  
tion, the FPGA application can continue to use the interface  
pins to communicate with the parallel Flash PROM. Parallel  
Flash PROMs are available in densities ranging from 1 Mbit  
up to 128 Mbits and beyond. However, a single Spartan-3E  
FPGA requires less than 6 Mbits for configuration. If  
90  
www.xilinx.com  
DS312-2 (v3.8) August 26, 2009  
Product Specification  
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