R
QPRO™ XQ4000XL Series QML High-Reliability FPGAs
Ordering Information
Example for QPRO™ military temperature part:
XQ 4062XL -3 PG 475 M
Mil-PRF-38535
(QML) Processed
Temperature Range
M = Military Ceramic (T = -55 C to +125 C)
o
o
C
N = Military Plastic (T = -55°C to +125°C)
J
Device Type
XQ4085XL
XQ4062XL
XQ4036XL
XQ4013XL
Number of Pins
Speed Grade
-3
-1 (XQ4085XL only)
Package Type
CB = Top Brazed Ceramic Quad Flat Pack
PG = Ceramic Pin Grid Array
PQ/HQ = Plastic Quad Flat Back
BG = Plastic Ball Grid Array
Example for SMD part:
5962 98511 01 Q X C
Generic Standard
Microcircuit Drawing (SMD)
Prefix
Lead Finish
C = Gold
B = Solder
Device Type
XQ4028EX = 98509
XQ4013XL = 98513
XQ4036XL = 98510
XQ4062XL = 98511
XQ4085XL = 99575
Package Type
X = Pin Grid
Y = Ceramic Quad Flat Pack (Base Mark)
Z = Ceramic Quad Flat Pack (Lid Mark)
T = Plastic Quad Flat Pack
U = Plastic Ball Grid
Speed Grade
01 = -4 for XQ4028EX
01 = -3 for XQ4103XL/4036XL/4062XL
01 = -1 for XQ4085XL
Q = QML Certified
N = QML Plastic (N - Grade)
Revision Control
Date
5/98
Version
1.0
Description
Original document release.
1/99
1.1
Addition of new packages, clarification of parameters.
Addition of XQ4085XL -1 speed grade part
2/9/00
1.2
DS029 (v1.2) February 9, 2000
19
XILINX [ XILINX, INC ]
