W83759A
PACKAGE DIMENSION
100-pin QFP
Dimension in mm
Dimension in inches
Symbol
Nom
Nom
Min.
Max. Min.
0.130
Max.
3.30
HD
A
D
0.004
0.10
1
A
100
81
0.107 0.112 0.117
0.010
0.004 0.006
0.546
2.73
0.25
0.10
2.85
0.30
2.97
0.40
A
b
c
D
E
e
2
0.012 0.016
0.010
80
1
0.15
0.25
14.00
20.00
0.65
0.556 13.87
14.13
20.13
0.80
0.551
19.87
0.792
0.782 0.787
0.020 0.026
0.032
0.752
0.50
0.728
0.740
D
H
18.80 19.10
18.49
0.964
0.039
0.087
0.988 24.49 24.80 25.10
0.976
0.047
0.094
HE
L
E
H
E
0.055
0.103
0.004
12
1.40
2.62
1.00
2.21
1.20
2.40
1
L
y
0.10
12
0
0
0
Notes:
1. Dimension D & E do not include interlead
flash.
51
30
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based on final
visual inspection spec.
31
50
e
b
c
2
A
A
1
A
See Detail F
L
y
Seating Plane
L 1
Detail F
Winbond Electronics (H.K.) Ltd.
Winbond Electronics North America Corp.
Headquarters
Rm. 803, World Trade Square, Tower II, Winbond Memory Lab.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792646
123 Hoi Bun Rd., Kwun Tong,
Winbond Microelectronics Corp.
Winbond Systems Lab.
Kowloon, Hong Kong
TEL: 852-27516023
FAX: 852-27552064
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
Publication Release Date: May 1995
Revision A1
- 41 -
WINBOND [ WINBOND ]
