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25M02GVTCIG 参数 Datasheet PDF下载

25M02GVTCIG图片预览
型号: 25M02GVTCIG
PDF下载: 下载PDF文件 查看货源
内容描述: [3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS]
分类和应用:
文件页数/大小: 68 页 / 820 K
品牌: WINBOND [ WINBOND ]
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W25M02GV  
12. REVISION HISTORY  
VERSION  
DATE  
PAGE  
DESCRIPTION  
New Create Preliminary  
A
03/31/2015  
26, 27  
36  
56  
60  
62  
Updated C2h / FFh command description  
Updated 02h / 84h command description  
Updated tVSL power up timing parameter  
Updated tRD2 in AC parameter table  
Updated WSON 8x6mm dimensions  
B
07/01/2015  
Preliminary Designation  
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully characterized.  
The specifications are subject to change and are not guaranteed. Winbond or an authorized sales  
representative should be consulted for current information before using this product.  
Trademarks  
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.  
All other marks are the property of their respective owner.  
Important Notice  
Winbond products are not designed, intended, authorized or warranted for use as components in systems  
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship  
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for  
other applications intended to support or sustain life. Furthermore, Winbond products are not intended for  
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,  
death or severe property or environmental damage could occur. Winbond customers using or selling these  
products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any  
damages resulting from such improper use or sales.  
Information in this document is provided solely in connection with Winbond products. Winbond  
reserves the right to make changes, corrections, modifications or improvements to this document  
and the products and services described herein at any time, without notice.  
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