W25M02GV
11.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25M02GV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use a 12-digit
Product Number for ordering. However, due to limited space, the Top Side Marking on all packages uses
an abbreviated 11-digit number.
Industrial Temperature:
PACKAGE TYPE
DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
W25M02GVZEIG
W25M02GVZEIT
25M02GVZEIG
25M02GVZEIT
ZE
2x1G-bit
WSON-8 8x6mm
TB
W25M02GVTBIG
W25M02GVTBIT
25M02GVTBIG
25M02GVTBIT
TFBGA-24 8x6mm
(5x5-1 Ball Array)
2x1G-bit
2x1G-bit
TC
W25M02GVTCIG
W25M02GVTCIT
25M02GVTCIG
25M02GVTCIT
TFBGA-24 8x6mm
(6x4 Ball Array)
Note:
W25M02GVxxIG: BUF=1 (Buffer Read Mode) is the default value for both stacked dies after power up. BUF bit can
be written to 0 individually.
W25M02GVxxIT: BUF=0 (Continuous Read Mode) is the default value for both stacked dies after power up. BUF bit
can be written to 1 individually.
Publication Release Date: July 1, 2015
- 66 -
Preliminary - Revision B
WINBOND [ WINBOND ]
