W25M02GV
11. ORDERING INFORMATION
(1)
(1)
W 25M 02G V xx I
W
=
Winbond
25M
02G
=
=
Serial MCP SpiFlash Memory with SpiStack
2G-bit (2 x 1G-bit) Serial SLC NAND Flash Memory
V
=
2.7V to 3.6V
ZE
TB
=
=
8-pad WSON 8x6mm
24-ball TFBGA 8x6-mm (5x5 ball array)
TC
=
24-ball TFBGA 8x6-mm (6x4 ball array)
I
=
Industrial (-40°C to +85°C)
(2)
G
T
=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
and BUF=1 is the default value after power up
=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
and BUF=0 is the default value after power up
Notes:
1. The “W” prefix is not included on the part marking.
2. Standard bulk shipments are in tray for WSON and TFBGA packages. For other packing options, please
specify when placing orders.
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