欢迎访问ic37.com |
会员登录 免费注册
发布采购

25M02GVTCIG 参数 Datasheet PDF下载

25M02GVTCIG图片预览
型号: 25M02GVTCIG
PDF下载: 下载PDF文件 查看货源
内容描述: [3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS]
分类和应用:
文件页数/大小: 68 页 / 820 K
品牌: WINBOND [ WINBOND ]
 浏览型号25M02GVTCIG的Datasheet PDF文件第25页浏览型号25M02GVTCIG的Datasheet PDF文件第26页浏览型号25M02GVTCIG的Datasheet PDF文件第27页浏览型号25M02GVTCIG的Datasheet PDF文件第28页浏览型号25M02GVTCIG的Datasheet PDF文件第30页浏览型号25M02GVTCIG的Datasheet PDF文件第31页浏览型号25M02GVTCIG的Datasheet PDF文件第32页浏览型号25M02GVTCIG的Datasheet PDF文件第33页  
W25M02GV  
8.2.3 Read JEDEC ID (9Fh)  
The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI compatible serial  
memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low and shifting the  
instruction code “9Fh” followed by 8 dummy clocks. The JEDEC assigned Manufacturer ID byte for  
Winbond (EFh) and two Device ID bytes are then shifted out on the falling edge of CLK with most  
significant bit (MSB) first as shown in Figure 6. For memory type and capacity values refer to  
Manufacturer and Device Identification table.  
Figure 6. Read JEDEC ID Instruction  
Publication Release Date: July 1, 2015  
- 28 -  
Preliminary - Revision B  
 复制成功!