W332M72V-XSBX
White Electronic Designs
specified for the clock pin) prior to CKE going back
HIGH. Once CKE is HIGH, the SDRAM must have NOP
commands issued (a minimum of two clocks) for tXSR
,
because time is required for the completion of any internal
refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH
commands must be issued as both SELF REFRESH and
AUTO REFRESH utilize the row refresh counter.
ABSOLUTE MAXIMUM RATINGS
Parameter
Unit
V
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on NC or I/O pins relative to Vss
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
-1 to 4.6
-1 to 4.6
V
-55 to +125
-40 to +85
-55 to +125
°C
°C
°C
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 2)
Parameter
Symbol
CI1
Max
Unit
pF
Input Capacitance: CLK
7
24
9
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
CA
pF
CI2
pF
CIO
9
pF
BGA THERMAL RESISTANCE
Description
Symbol
Theta JA
Theta JB
Theta JC
Typical
17.0
Unit
C/W
C/W
C/W
Notes
Junction to Ambient (No Airflow)
Junction to Ball
1
1
1
16.6
Junction to Case (Top)
7.4
NOTE:
Refer to Application Note “PBGA Thermal Resistance Correlation” at www.wedc.com in the
application notes section for modeling conditions.
Ju;y 2006
Rev. 3
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
