VSC6134
Datasheet
8
Ordering Information
The VSC6134 device is available in two package types. VSC6134ST and VSC6134ST-01 are an
897-pin, flip chip ball grid array (FCBGA) with a 35 mm × 35 mm body size, 1 mm pitch, and 3.53 mm
maximum height. These devices are also available in lead(Pb)-free (second-level interconnect only)
packages, VSC6134XST and VSC6134XST-01.
Lead(Pb)-free products from Vitesse comply with the temperatures and profiles defined in the joint IPC
and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
The following table lists the ordering information for the VSC6134 device.
Table 472. Ordering Information
Part Number
Description
VSC6134ST
For 10 Gbps applications, 897-pin FCBGA with a 35 mm × 35 mm body size, 1 mm pitch, and
3.53 mm maximum height
VSC6134XST
For 10 Gbps applications, lead(Pb)-free (second-level interconnect only), 897-pin FCBGA with
a 35 mm × 35 mm body size, 1 mm pitch, and 3.53 mm maximum height
VSC6134ST-01
For 2.5 Gbps applications, 897-pin FCBGA with a 35 mm × 35 mm body size, 1 mm pitch, and
3.53 mm maximum height
VSC6134XST-01 For 2.5 Gbps applications, lead(Pb)-free (second-level interconnect only), 897-pin FCBGA with
a 35 mm × 35 mm body size, 1 mm pitch, and 3.53 mm maximum height
437 of 438
VMDS-10185 Revision 4.0
July 2006
438
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
