VSC6134
Datasheet
Figure 92. Package Drawing
Top View
aaa
B
A
D
Pin 1
Detail A
bbb C
A1 A2
A
C
C
E
Solder ball
C
ddd C
Seating plane
2
Chip
aaa
Cross Section C-C
Detail B
eee M C A B
fff M
b
C
Detail A
C
B
A
Bottom View
3
D1
e
AP
AN
AM
AL
AK
AJ
1
2
3
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
E1
T
R
P
Dimensions and Tolerances
N
M
L
K
J
Reference Minimum Nominal Maximum
H
G
3.13
0.50
2.63
35.00
33.00
35.00
33.00
1.00
0.60
0.20
0.25
0.20
0.30
0.10
A
3.53
0.60
2.93
F
E
D
0.40
34.80
34.80
A1
A2
D
D1
E
E1
e
b
aaa
bbb
ddd
eee
fff
C
B
A
1
3
5
7
9
11 13 15 17 19 21 23 25 27 29 31 33
10 12 14 16 18 20 22 24 26 28 30 32 34
2
4
6
8
35.20
Pin 1
Detail B
35.20
0.70
Notes
1. All dimensions and tolerances are in millimeters (mm).
0.50
2. Primary datum
C
and seating plane are defined by the spherical
crowns of the solder balls.
3. Dimension b is measured at the maxium solder ball diameter, parallel
to primary datum C .
4. There is a minimum clearance of 0.25 mm between the edge of the
solder ball and the body edge.
430 of 438
VMDS-10185 Revision 4.0
July 2006
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
