VSC6134
Datasheet
6
Package Information
The VSC6134 device is available in two package types. VSC6134ST and VSC6134ST-01 are an
897-pin, flip chip ball grid array (FCBGA) with a 35 mm × 35 mm body size, 1 mm pitch, and 3.53 mm
maximum height. These devices are also available in lead(Pb)-free (second-level interconnect only)
packages, VSC6134XST and VSC6134XST-01.
This section provides the package drawing, thermal specifications, and moisture sensitivity rating for
the VSC6134 device.
Lead(Pb)-free products from Vitesse comply with the temperatures and profiles defined in the joint IPC
and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
6.1
Package Drawing
The following illustration shows the package drawing for the VSC6134 device. The drawing contains
the top view, bottom view, detail views, cross section, dimensions, tolerances, and notes.
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VMDS-10185 Revision 4.0
July 2006
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
