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UP0114 参数 Datasheet PDF下载

UP0114图片预览
型号: UP0114
PDF下载: 下载PDF文件 查看货源
内容描述: [Linear Fan Driver with VOUT Fully On Control]
分类和应用:
文件页数/大小: 12 页 / 120 K
品牌: UNITPOWER [ ShenZhen XinDeYi Electronics Co., Ltd. ]
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uP0114  
Application Information  
The uP0114 is high performance positive voltage regulator PD = (5V- 3.0V) x 0.2A = 0.4W  
specifically designed for applications where very low  
dropout voltage is required. It is capable of delivering 0.6A  
output current with 150mV dropout voltage and 115uA  
quiescent current.  
This power dissipation is conducted through the package  
into the ambient environment, and, in the process, the  
temperature of the die (TJ) rises above ambient. Large  
power dissipation may cause considerable temperature  
raise in the regulator in large dropout applications. The  
geometry of the package and of the printed circuit board  
(PCB) greatly influence how quickly the heat is transferred  
to the PCB and away from the chip. The most commonly  
used thermal metrics for IC packages are thermal  
resistance from the chip junction to the ambient air  
surrounding the package (θJA):  
Input/Output Capacitor Selection  
The uP0114 has a fast transient response that allows it to  
handle large load changes associated with high current  
applications. Proper selection of the output capacitor and  
it’s ESR value determines stable operation and optimizes  
performance. The typical application circuit shown in  
Typical Application Circuit. The circuit was found to be  
unconditionally stable with capacitor values from 2.2ìF to  
47000ìF and ESR ranging from 0.5mΩ to greater then  
75mΩ.  
θJA = ( TJ -TA ) / PD  
θJA specified in the Thermal Information section is  
measured in the natural convection at TA = 25OC on a  
Input capacitor: A minimum of 2.2uF ceramic capacitor high effective thermal conductivity test board (4 Layers,  
is recommended to be placed directly next to the VIN pin. 2S2P) of JEDEC 51-7 thermal measurement standard.  
This allows for the device being some distance from any The case point of θJC is on the pin 6 (GND) for FSOP-8  
bulk capacitance on the rail.Additionally, bulk capacitance package.  
may be added closely to the input supply pin of the uP0114  
to ensure that VIN does not sag, improving load transient  
response.  
Given power dissipation PD, ambient temperature and  
thermal resistance θJA, the junction temperature is  
calculated as:  
Output capacitor: Aminimum bulk capacitance of 2.2uF,  
TJ = TA + ΔTJA = TA + PD x θJA  
along with a 0.1uF ceramic decoupling capacitor is  
To limit the junction temperature within its maximum rating,  
recommended. Increasing the bulk capacitance will  
the allowable maximum power dissipation is calculated  
improve the overall transient response. The use of multiple  
as:  
lower value ceramic capacitors in parallel to achieve the  
desired bulk capacitance will not cause stability issues.  
Although designed for use with ceramic output capacitors,  
the uP0114 is extremely tolerant of output capacitor ESR  
values and thus will also work comfortably with tantalum  
output capacitors.  
PD(MAX) = ( TJ(MAX) -TA ) /θJA  
where TJ(MAX) is the maximum operation junction  
temperature 125OC, TA is the ambient temperature and  
the θJA is the junction to ambient thermal resistance. θJA  
of PSOP-8 packages is 75OC/W on JEDEC 51-7 (4 layers,  
2S2P) thermal test board with minimum copper area. The  
maximum power dissipation at TA = 25¢X C can be  
calculated as:  
Thermal Consideration  
The uP0114 integrates internal thermal limiting function  
to protect the device from damage during fault conditions.  
However, continuously keeping the junction near the  
thermal shutdown temperature may remain possibility to  
affect device reliability. It is highly recommended to keep  
the junction temperature below the recommended  
operation condition 125OC for maximum reliability.  
P
D(MAX) = (125OC - 25OC) / 75OC/W = 1.33W  
The thermal resistance θJA highly depends on the PCB  
design. Copper plane under the exposed pad is an  
effective heatsink and is useful for improving thermal  
conductivity.  
Power dissipation in the device is calculated as:  
Figure 1 illustrated the recommended PCB layout for best  
thermal performance.  
ΠΔ = (ςΙΝ − ςΟΥΤ) ξ ΙΟΥΤ + ςΙΝ ξ ΙΘ  
It is adequate to neglect power loss with respective to  
control circuit VIN x IQ when considering thermal  
management in uP0114 Take the following moderate  
operation condition as an example: VIN = 5V, VOUT = 3V,  
IOUT = 0.2A, the power dissipation is:  
uPI Semiconductor Corp., http://www.upi-semi.com  
Rev. P00, File Name: uP0114-DS-P0000  
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