uP0114
Package Information
SOP - 8L
0.70 ± 0.10
1.27
± 0.10
4.80 - 5.00
1.27 BSC
0.32 - 0.52
Recommended Solder Pad Layout
1.45 - 1.60
0.18 - 0.25
1.75 MAX
0.10 - 0.25
0.41 - 0.89
3.81 BSC
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.
uPI Semiconductor Corp., http://www.upi-semi.com
Rev. P00, File Name: uP0114-DS-P0000
12
UNITPOWER [ ShenZhen XinDeYi Electronics Co., Ltd. ]
