uP0114
Package Information
SOT23 - 8L
0.45 ± 0.05
0.65
± 0.05
2.70 - 3.10
0.65 BSC
0.22 - 0.38
Recommended Solder Pad Layout
0.90 - 1.30
1.45 MAX
0.08 - 0.22
0.00 - 0.15
1.95 BSC
0.30 - 0.60
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.
uPI Semiconductor Corp., http://www.upi-semi.com
Rev. P00, File Name: uP0114-DS-P0000
11
UNITPOWER [ ShenZhen XinDeYi Electronics Co., Ltd. ]
