CHA3092
20-33GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
To Vd1,2,3,4 DC Drain supply feed
100pF
IN
OUT
100pF
100pF
To Vgs1 DC Gate supply feed
To external control circuit ( 10kOhm )
To Vgs2,3,4 DC Gate supply feed
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended.
1720 +/- 35
1370
1030
700
450
290
880 +/- 35
440
270
160
340
640
940
1340
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA30920356 21-Dec.-00
6/7
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
