UCC28610
www.ti.com ......................................................................................................................................... SLUS888C–JANUARY 2009–REVISED SEPTEMBER 2009
TYPICAL CHARACTERISTICS (continued)
Unless otherwise stated: VDD = 12V, VGG = 12V, ZCD = 1 V, FB = 0 V, GND = 0 V, a 0.1-µF capacitor between VDD and
GND, a 0.1-µF capacitor between VGG and GND, RCL = 33.2 kΩ, RMOT = 380 kΩ, –40°C < TA < +125°C, TJ = TA
DRIVER RDS(on)
vs
AMBIENT TEMPERATURE
RDS(on) of HIGH SIDE DRIVE and VDD Switch
vs
TEMPERATURE
180
160
140
120
12
High-Side Drive
VDD Switch
10
8
6
4
100
80
60
40
20
2
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
T
– Ambient Temperature – °C
T
– Ambient Temperature – °C
A
A
Figure 15.
Figure 16.
SAFE OPERATING AREA
vs
BOARD TEMPERATURE
THERMAL COEFFICIENT – θJB
vs
POWER DISSIPATION
2.5
2.0
60
50
40
1.5
30
20
1.0
0.5
Package
SOIC (D)
Package
SOIC (D)
DIP (P)
10
DIP (P)
0
0.0
0
0.25
0.50
0.75
1.00
-40
-20
0
20
40
60
80
100 120
P
– Power Dissipation – W
T
– Board Temperature – °C
DISS
B
Figure 17.
Figure 18.
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