欢迎访问ic37.com |
会员登录 免费注册
发布采购

UCC21759QDWRQ1 参数 Datasheet PDF下载

UCC21759QDWRQ1图片预览
型号: UCC21759QDWRQ1
PDF下载: 下载PDF文件 查看货源
内容描述: [适用于 IGBT/SiC MOSFET 且具有 DESAT 和内部钳位的汽车类 3.0kVrms、±10A 单通道隔离式栅极驱动器 | DW | 16 | -40 to 150]
分类和应用: 栅极驱动双极性晶体管驱动器
文件页数/大小: 57 页 / 2481 K
品牌: TI [ TEXAS INSTRUMENTS ]
 浏览型号UCC21759QDWRQ1的Datasheet PDF文件第46页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第47页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第48页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第49页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第51页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第52页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第53页浏览型号UCC21759QDWRQ1的Datasheet PDF文件第54页  
UCC21759-Q1  
SLUSEB4A – AUGUST 2020 – REVISED DECEMBER 2020  
www.ti.com  
12 Device and Documentation Support  
12.1 Documentation Support  
12.1.1 Related Documentation  
For related documentation see the following:  
Isolation Glossary  
12.2 Receiving Notification of Documentation Updates  
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper  
right corner, click on Alert me to register and receive a weekly digest of any product information that has  
changed. For change details, review the revision history included in any revised document.  
12.3 Support Resources  
TI E2Esupport forums are an engineer's go-to source for fast, verified answers and design help — straight  
from the experts. Search existing answers or ask your own question to get the quick design help you need.  
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do  
not necessarily reflect TI's views; see TI's Terms of Use.  
12.4 Trademarks  
TI E2Eis a trademark of Texas Instruments.  
All trademarks are the property of their respective owners.  
12.5 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
12.6 Glossary  
TI Glossary  
This glossary lists and explains terms, acronyms, and definitions.  
13 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical packaging and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
Copyright © 2020 Texas Instruments Incorporated  
50  
Submit Document Feedback  
 
 
 
 
 
 
 
 
 复制成功!