TVP5160
SLES135E–FEBRUARY 2005–REVISED APRIL 2011
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7
Designing With PowerPAD™
The TVP5160 device is housed in a high-performance, thermally enhanced, 128-pin PowerPAD package
(TI package designator: 128PFP). Use of the PowerPAD package does not require any special
considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the
device, is a metallic thermal and electrical conductor. Therefore, if not implementing the PowerPAD PCB
features, the use of solder masks (or other assembly techniques) may be required to prevent any
inadvertent shorting by the exposed PowerPAD of connection etches or vias under the package. The
recommended option, however, is not to run any etches or signal vias under the device, but to have only a
grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the
minimum size required for the keep out area for the 128-terminal PFP PowerPAD package is 8.8 mm ×
8.8 mm and is centered on the device package.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land will vary in size, depending on the PowerPAD package being used,
the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may
or may not contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI web
site at www.ti.com.
For the TVP5160 device, this thermal land must be grounded to the low impedance ground plane of the
device. This improves not only thermal performance but also the electrical grounding of the device. It is
also recommended that the device ground terminal landing pads be connected directly to the grounded
thermal land. The land size must be as large as possible without shorting device signal terminals. The
thermal land may be soldered to the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink,
it is recommended that the thermal land be connected to the low impedance ground plane for the device.
More information may be obtained from the TI application note PHY Layout, TI literature number
SLLA020.
104
Designing With PowerPAD™
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