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TPS7H5008MPWTSEP 参数 Datasheet PDF下载

TPS7H5008MPWTSEP图片预览
型号: TPS7H5008MPWTSEP
PDF下载: 下载PDF文件 查看货源
内容描述: [TPS7H500x-SEP Radiation-Tolerant 2-MHz Current Mode PWM Controllers in Space Enhanced Plastic]
分类和应用:
文件页数/大小: 71 页 / 4323 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TPS7H5005-SEP, TPS7H5006-SEP, TPS7H5007-SEP, TPS7H5008-SEP  
www.ti.com  
SLVSGG1 – FEBRUARY 2022  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating temperature range (unless otherwise noted)(1)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–55  
MAX  
16  
UNIT  
VIN  
RT, VSENSE, SS, RSC, COMP, PS, SP, HICC, LEB  
3.3  
7.5  
7.5  
7.5  
7.5  
7.5  
3.3  
150  
150  
Input  
SYNC  
V
EN, FAULT  
DCL, CS_ILIM  
OUTA, OUTB, SRA and SRB  
VLDO  
Output  
V
REFCAP  
TJ  
Junction temperature  
Storage temperature  
°C  
Tstg  
–65  
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress  
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated  
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability.  
7.2 ESD Ratings  
VALUE  
±1000  
±250  
UNIT  
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)  
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)  
V(ESD)  
Electrostatic discharge  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating temperature range (unless otherwise noted)  
MIN  
NOM  
MAX  
14  
UNIT  
V
VIN  
SRVIN  
TJ  
Supply voltage  
4
Input voltage slew rate  
Junction temperature  
0.03  
125  
V/µs  
°C  
–55  
7.4 Thermal Information  
TP7H500x-SEP  
TSSOP  
24 PINS  
74.5  
THERMAL METRIC(1)  
UNIT  
RθJA  
RθJB  
RθJC(top)  
ψJT  
Junction-to-ambient thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
30.8  
Junction-to-case (top) thermal resistance  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
17.9  
0.8  
ψJB  
30.3  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
Copyright © 2022 Texas Instruments Incorporated  
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Product Folder Links: TPS7H5005-SEP TPS7H5006-SEP TPS7H5007-SEP TPS7H5008-SEP  
 
 
 
 
 
 
 
 
 
 
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