TPS7H5005-SEP, TPS7H5006-SEP, TPS7H5007-SEP, TPS7H5008-SEP
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SLVSGG1 – FEBRUARY 2022
7 Specifications
7.1 Absolute Maximum Ratings
over operating temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–55
MAX
16
UNIT
VIN
RT, VSENSE, SS, RSC, COMP, PS, SP, HICC, LEB
3.3
7.5
7.5
7.5
7.5
7.5
3.3
150
150
Input
SYNC
V
EN, FAULT
DCL, CS_ILIM
OUTA, OUTB, SRA and SRB
VLDO
Output
V
REFCAP
TJ
Junction temperature
Storage temperature
°C
Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating temperature range (unless otherwise noted)
MIN
NOM
MAX
14
UNIT
V
VIN
SRVIN
TJ
Supply voltage
4
Input voltage slew rate
Junction temperature
0.03
125
V/µs
°C
–55
7.4 Thermal Information
TP7H500x-SEP
TSSOP
24 PINS
74.5
THERMAL METRIC(1)
UNIT
RθJA
RθJB
RθJC(top)
ψJT
Junction-to-ambient thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
30.8
Junction-to-case (top) thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
17.9
0.8
ψJB
30.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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