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SLVS456C − OCTOBER 2003 − REVISED OCTOBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
OUTPUT VOLTAGE
PACKAGE
PART NUMBER
−40°C to 85°C
Adjustable to 0.891 V
Plastic HTSSOP (PWP)
TPS54350PWP
(1)
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e. TPS54350PWPR).
(1)
PACKAGE DISSIPATION RATINGS
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
T
= 25°C
T
= 70°C
T = 85°C
A
POWER RATING
A
A
PACKAGE
POWER RATING
POWER RATING
16-Pin PWP with solder(2)
16-Pin PWP without solder
42.1°C/W
2.36
0.66
1.31
0.36
0.95
0.26
151.9°C/W
(1)
(2)
See Figure 46 for power dissipation curves.
Test Board Conditions
1. Thickness: 0.062”
2. 3” x 3”
3. 2 oz. Copper traces located on the top and bottom of the PCB for soldering
4. Copper areas located on the top and bottom of the PCB for soldering
5. Power and Ground planes, 1 oz. Copper (0.036 mm thick)
6. Thermal vias, 0.33 mm diameter, 1.5 mm pitch
7. Thermal isolation of power plane
For more information, refer to TI technical brief SLMA002.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range unless otherwise noted
UNIT
VIN
−0.3 V to 21.5 V
VSENSE
UVLO
−0.3 V to 8.0 V
−0.3 V to 8.0 V
−0.3 V to 4.0 V
−0.3 V to 4.0 V
VI(PH) + 8.0 V
−0.3 to 8.5 V
−0.3 to 8.5 V
−0.3 to 4.0 V
−0.3 to 4.0 V
−0.3 to 6.0 V
−0.3 to 4.0 V
−1.5 V to 22 V
Internally Limited (A)
10 mA
Input voltage range, V
I
SYNC
ENA
BOOT
VBIAS
LSG
SYNC
RT
Output voltage range, V
O
PWRGD
COMP
PH
PH
LSG (Steady State Current)
COMP, VBIAS
SYNC
Source current, I
O
3 mA
5 mA
LSG (Steady State Current)
PH (Steady State Current)
COMP
100 mA
500 mA
Sink current, I
S
3 mA
ENA, PWRGD
AGND to PGND
10 mA
Voltage differential
0.3 V
Operating virtual junction temperature range, T
−40°C to +150°C
−65°C to +150°C
260°C
J
Storage temperature, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
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