TPS40200-Q1
www.ti.com
SLUS739D –SEPTEMBER 2006–REVISED JULY 2011
Table 3. Bill of Materials, Buck Regulator, 12 V to 3.3 V and 5 V
REF
C1
VALUE
100 μF
220 μF
100 pF
0.1 pF
1 μF
DESCRIPTION
Capacitor, Aluminum, SM, 25 V, 0.3 Ω
Capacitor, Aluminum, SM, 6.3 V, 0.4 Ω
Capacitor, Ceramic, 50 V, [COG], [20%]
Capacitor, Ceramic, 50 V, [X7R], [20%]
Capacitor, Ceramic, 50 V, [X7R], [20%]
Capacitor, Ceramic, 50 V, [X7R], [20%]
Capacitor, Ceramic, 50 V, [X7R], [20%]
Capacitor, Ceramic, 50 V, [COG], [20%]
Capacitor, Ceramic, 50 V, [X7R], [20%]
Diode, Zener, 12 V, 350 mW
SIZE
MFR
PART NUMBER
20SVP100M
8 mm × 10 mm Sanyo
C12
C13
C3
8 mm × 6.2 mm Panasonic
EEVFC0J221P
603
muRata
muRata
muRata
muRata
muRata
muRata
muRata
Std.
Std.
Std.
Std.
Std.
Std.
Std.
603
C2, C11
C4, C5
C6
603
470 pF
0.047 μF
10 pF
603
603
C7
603
C8
1500 pF
12 V
603
D1
SOT23
SMC
VMD2
0.8 × 0.35
0.100 × 2
Diodes, Inc. BZX84C12T
D2
Diode, Schottky, 30 A, 30 V
On Semi
Rohm
OST
MBRS330T3
VDZT2R12B
ED2227
D3
12 V
Diode Zener, 12 V, 5 mA
J1,J3
J2
Terminal Block, 4 Pin, 15 A, 5.1 mm
Header, 2 pin, 100-mil spacing (36-pin strip)
Inductor, SMT, 3.2 A, 0.039 Ω
Sullins
PTC36SAAN
SLF12575T330M3R2PF
HPA164
L1
33 μH
12.5 × 12.5 mm TDK
PCB
2-Layer PCB 2-Ounce Cu
1.4 × 2.12 ×
0.062
Q1
Q2
U1
Trans, N-Chan Enhancement Switching, 50 mA
MOSFET, P-ch, 30 V, 3.6 A, 75 mΩ
IC, Low Cost Non-Sync Buck Controller
Resistor, Chip, 1/16 W, 1%
SOT-143B
SuperSOT-6
SO-8
603
Phillips
BSS83
FDC654P
TPS40200D
Std.
Fairchild
TI
R1
10 Ω
100 kΩ
10 kΩ
1 MΩ
Std.
Std.
Std.
Std.
Std.
Std.
Std.
Std.
Std.
Std.
Std.
Std.
R10
R11
R12
R13
R2
Resistor, Chip, , 1/16W, 1%
Resistor, Chip, 1/16 W, 1%
603
Std.
603
Std.
Resistor, Chip, 1/16 W, 1%
603
Std.
49.9 Ω
0.02 Ω
68.1 kΩ
2.0 kΩ
0 Ω
Resistor, Chip, 1/16 W, 1%
603
Std.
Resistor, Chip, 1/16 W, 5%
2010
603
Std.
R3
Resistor, Chip, 1/16 W, 1%
Std.
R4
Resistor, Chip, 1/16 W, 1%
603
Std.
R5
Resistor, Chip, 1/16 W, 1%
603
Std.
R6
26.7 kΩ
1.0 kΩ
300 kΩ
Resistor, Chip, 1/16 W, 1%
603
Std.
R7
Resistor, Chip, 1/16 W, 1%
603
Std.
R8
Resistor, Chip, 1/16 W, 1%
603
Std.
PCB Plots
Figure 45 through Figure 47 show the design of the TPS40200EVM-001 printed circuit board. The design uses
2-layer 2-oz copper and is 1.4 in × 2.3 in. All components are mounted on the top side to allow the user to easily
view, probe, and evaluate the TPS40200 control IC in a practical application. Moving components to both sides
of the PCB or using additional internal layers can offer additional size reduction for space-constrained
applications.
Copyright © 2006–2011, Texas Instruments Incorporated
31
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