TPS1HC100-Q1
ZHCSLK6A –JULY 2021 –REVISED DECEMBER 2021
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11.2.2 With a GND Network
With a GND network, tie the thermal pad with a single trace through the GND network to the board GND copper.
RGND
DGND
RPROT
CVBB_IC
CVBB
G
RPROT
DIAG_
FAU
LAT
S
RPU
RPROT
RPROT
RPROT
CVOUT
RSNS
CFILTER
ILIM
RLI
图11-2. Layout With a GND Network
11.3 Thermal Considerations
This device possesses thermal shutdown (TABS) circuitry as a protection from overheating. For continuous
normal operation, the junction temperature must not exceed the thermal-shutdown trip point. If the junction
temperature exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls
below the thermal shutdown hysteresis, the output turns on again.
Calculate the power dissipated by the device according to Equation 13.
PT = IOUT 2 × RDSON + VBB × IQ
(16)
where
• PT = total power dissipation of the device
After determining the power dissipated by the device, calculate the junction temperature from the ambient
temperature and the device thermal impedance.
TJ = TA + RθJA × PT
(17)
For more information, please see the How to Drive Resistive, Inductive, Capacitive, and Lighting Loads
application note.
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