Development Support
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package
type (for example, PBK) and temperature range (for example, A). Figure 5−1 provides a legend for reading
the complete device name for any TMS320x28x family member.
A
TMS 320
F
2810
PBK
PREFIX
TEMPERATURE RANGE
TMX = experimental device
TMP = prototype device
TMS = qualified device
A
S
Q
=
=
=
−40°C to 85°C
−40°C to 125°C
−40°C to 125°C − Q100
fault grading
†‡
PACKAGE TYPE
DEVICE FAMILY
320 = TMS320 DSP Family
GHH = 179-ball MicroStar BGA
ZHH = 179-ball MicroStar BGA (lead-free)
PGF = 176-pin LQFP
PBK = 128-pin LQFP
DEVICE
2810
2811
2812
TECHNOLOGY
F
=
Flash EEPROM (1.8-V/1.9-V Core/3.3-V I/O)
C = ROM (1.8-V/1.9-V Core/3.3-V I/O)
†
‡
BGA
=
Ball Grid Array
LQFP = Low-Profile Quad Flatpack
LQFP package not yet available lead (Pb)-free. For estimated conversion dates, go to www.ti.com/leadfree
Figure 5−1. TMS320x28x Device Nomenclature
5.2
Documentation Support
Extensive documentation supports all of the TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data sheets
and data manuals, with design specifications; and hardware and software applications. Useful reference
documentation includes:
TMS320C28x DSP CPU and Instruction Set Reference Guide (literature number SPRU430) describes the
central processing unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point
digital signal processors (DSPs). It also describes emulation features available on these DSPs.
TMS320x281x Analog-to-Digital Converter (ADC) Reference Guide (literature number SPRU060)
describes the ADC module. The module is a 12-bit pipelined ADC. The analog circuits of this converter,
referred to as the core in this document, include the front-end analog multiplexers (MUXs), sample-and-hold
(S/H) circuits, the conversion core, voltage regulators, and other analog supporting circuits. Digital circuits,
referred to as the wrapper in this document, include programmable conversion sequencer, result registers,
interface to analog circuits, interface to device peripheral bus, and interface to other on-chip modules.
TMS320x281x Boot ROM Reference Guide (literature number SPRU095) describes the purpose and
features of the bootloader (factory-programmed boot-loading software). It also describes other contents of the
device on-chip boot ROM and identifies where all of the information is located within that memory.
TMS320x281x Event Manager (EV) Reference Guide (literature number SPRU065) describes the EV
modules that provide a broad range of functions and features that are particularly useful in motion control and
motor control applications. The EV modules include general-purpose (GP) timers, full-compare/PWM units,
capture units, and quadrature-encoder pulse (QEP) circuits.
TMS320x281x External Interface (XINTF) Reference Guide (literature number SPRU067) describes the
external interface (XINTF) of the 281x digital signal processors (DSPs).
87
April 2001 − Revised December 2004
SPRS174L
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