TMS320C6672
Multicore Fixed and Floating-Point Digital Signal Processor
SPRS708C—February 2012
www.ti.com
B Mechanical Data
B.1 Thermal Data
Table B-1 shows the thermal resistance characteristics for the PBGA - CYP mechanical package.
Table B-1
No.
Thermal Resistance Characteristics (PBGA Package) [CYP]
°C/W
0.18
3.71
1
2
RθJC
RθJB
Junction-to-case
Junction-to-board
End of Table B-1
B.2 Packaging Information
The following packaging information reflects the most current released data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
Copyright 2012 Texas Instruments Incorporated
Mechanical Data 223
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