TMP435
SBOS495A –MARCH 2010–REVISED APRIL 2010
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
TWO-WIRE
ADDRESS
PACKAGE
MARKING
PRODUCT
DESCRIPTION
PACKAGE-LEAD PACKAGE DESIGNATOR
MSOP-10 DGS
Remote Junction
Temperature Sensor
TMP435
Pin-programmable
DTPI
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
TMP435
+7.0
UNIT
V
Power Supply, VS
Input Voltage
Pins 2, 3, 4, 5 and 8 only
Pins 7, 9, and 10 only
–0.5 to VS + 0.5
–0.5 to 7
10
V
V
Input Current
mA
°C
°C
°C
V
Operating Temperature Range
Storage Temperature Range
Junction Temperature (TJ max)
–55 to +127
–60 to +130
+150
Human Body Model (HBM)
4000
ESD Rating
Charged Device Model (CDM)
Machine Model (MM)
1000
V
200
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
2
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