THS4631
www.ti.com
SLOS451A–DECEMBER 2004–REVISED MARCH 2005
Results are with no air flow and PCB size = 3" x 3 "
θJA
= 58.4°C/W for the 8-pin MSOP with
PowerPAD (DGN).
θJA = 98°C/W for the 8-pin SOIC high-K test PCB
(D).
θJA
= 158°C/W for the 8-pin MSOP with
PowerPAD, without solder.
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to not only consider quiescent power dissi-
pation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem
DESIGN TOOLS EVALUATION FIXTURE,
SPICE MODELS, AND APPLICATIONS
SUPPORT
Texas Instruments is committed to providing its cus-
tomers with the highest quality of applications sup-
port. To support this goal an evaluation board has
been developed for the THS4631 operational ampli-
fier. The board is easy to use, allowing for straightfor-
ward evaluation of the device. The evaluation board
can be ordered through the Texas Instruments web
site, www.ti.com, or through your local Texas Instru-
ments sales representative. The board layers are
provided in Figure 47, Figure 48, and Figure 49. The
bill of materials for the evaluation board is provided in
Table 2.
Figure 48. EVM Layers 2 and 3, Ground
Figure 49. EVM Bottom Layer
Figure 47. EVM Top Layer
17
TI [ TEXAS INSTRUMENTS ]
