SN65HVD72
SN65HVD75
SN65HVD78
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SLLSE11B –MARCH 2012–REVISED JUNE 2012
ABSOLUTE MAXIMUM RATINGS(1)
VALUE
UNIT
MIN
MAX
5.5
Supply Voltage, VCC
–0.5
–13
V
V
Voltage range at A or B Inputs
16.5
5.7
Input voltage range at any logic pin
–0.3
–100
–24
V
Voltage input range, transient pulse, A and B, through 100Ω
Receiver Output Current
100
24
V
mA
°C
°C
Junction Temperature, TJ
170
150
Storage Temperature,
-65
Continuous total power dissipation
See the Thermal Characteristics table
IEC 61000-4-2 ESD (Air-Gap Discharge), bus terminals and GND
IEC 61000-4-2 ESD (Contact Discharge), bus terminals and GND
IEC 61000-4-4 EFT (Fast transient or burst) bus terminals and GND
IEC 60749-26 ESD (Human Body Model), bus terminals and GND
JEDEC Standard 22, Test Method A114 (Human Body Model), all pins
JEDEC Standard 22, Test Method C101 (Charged Device Model), all pins
JEDEC Standard 22, Test Method A115 (Machine Model), all pins
±12
±12
±4
kV
kV
kV
kV
kV
kV
V
±15
±8
±1.5
±300
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
VCC
VI
Supply voltage
3
–7
2
3.3
3.6
12
V
V
(1)
Input voltage at any bus terminal (separately or common mode)
VIH
VIL
VID
IO
High-level input voltage (Driver, driver enable, and receiver enable inputs)
VCC
0.8
12
V
Low-level input voltage (Driver, driver enable, and receiver enable inputs)
Differential input voltage
0
V
–12
–60
–8
54
V
Output current, Driver
60
mA
mA
Ω
IO
Output current, Receiver
8
RL
CL
Differential load resistance
60
50
Differential load capacitance
HVD72
pF
250 kbps
20 Mbps
50 Mbps
Signaling rate
HVD75
HVD78
1/tUI
(2)
TA
TJ
Operating free-air temperature (See the application section for thermal information)
Junction Temperature
–40
–40
125
150
°C
°C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be
considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which
disables the driver outputs when the junction temperature reaches 170°C.
Copyright © 2012, Texas Instruments Incorporated
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