MECHANICAL DATA
MCPG014A – FEBRUARY 1996 – REVISED JANUARY 2002
GB (S-CPGA-P181)
CERAMIC PIN GRID ARRAY
1.590 (40,40)
1.560 (39,62)
SQ
1.400 (35,56) TYP
0.100 (2,54) TYP
R
P
N
M
L
K
J
H
G
F
A1 Corner
E
D
C
B
A
1 2
3
4
5
6
7
8
9 10 11 12 13 14 15
Bottom View
0.185 (4,70)
0.140 (3,55)
0.055 (1,40)
0.045 (1,14)
0.140 (3,56)
0.120 (3,05)
0.050 (1,27) DIA
4 Places
0.022 (0,55)
0.016 (0,41)
DIA TYP
4073426/C 11/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark can appear on top or bottom, depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to
each other at maximum material condition and within 0.030 (0,76) diameter
relative to the edge of the ceramic.
E. This package can be hermetically sealed with metal lids or with ceramic lids using glass frit.
F. The pins can be gold-plated or solder-dipped.
G. Falls within MIL-STD-1835 CMGA7-PN
1
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